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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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Cpu Maker
  1. AMD 2 elementi
  2. Arm System ready NXP 1 elemento
  3. MediaTek 3 elementi
  4. NXP 31 elementi
  5. Qualcomm 4 elementi
  6. Rockchip 3 elementi
  7. Raspberry Pi 1 elemento
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 12 elementi
  3. range < 5 W 5 elementi
  4. range > 25 W 1 elemento
Cpu Type
  1. AMD® Ryzen™ embedded 1 elemento
  2. MediaTek Genio 510 1 elemento
  3. MediaTek Genio 700 1 elemento
  4. NXP i.MX 8M 5 elementi
  5. NXP i.MX 8M Mini 6 elementi
  6. NXP i.MX 8M Nano 3 elementi
  7. NXP i.MX 8M Plus 2 elementi
  8. NXP i.MX 8X 2 elementi
  9. NXP i.MX 93 1 elemento
  10. NXP i.MX 933/935 1 elemento
  11. NXP i.MX 95 2 elementi
  12. NXP i.MX6 10 elementi
  13. NXP i.MX8 3 elementi
  14. Qualcomm® QCS5430 1 elemento
  15. Qualcomm® QCS6490 1 elemento
  16. Rockchip RK3399 2 elementi
  17. Rockchip RK3568 1 elemento
  18. Zynq® Ultras 1 elemento
  19. Qualcomm Dragonwing IQ-X 1 elemento
  20. MediaTek Genio360 1 elemento
  21. Qualcomm® Dragonwing IQ-8 1 elemento
Ethernet
  1. ETHERNET≥1 39 elementi
  2. ETHERNET≥2 18 elementi
Form Factor
  1. COM Express® 2 elementi
  2. Myon MicroModule SOM 1 elemento
  3. Qseven 5 elementi
  4. SMARC 11 elementi
  5. Trizeps SODIMM SOM 5 elementi
  6. Boxed Solutions 2 elementi
  7. Modular HMIs 6 elementi
  8. Single Board Computer 1 elemento
  9. Single Board Computer 11 elementi
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 elemento
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 elemento
  3. 48,5 x 32,5 mm 1 elemento
  4. 67,6 x 36,7 mm 5 elementi
  5. ≤ 100 x 100mm 15 elementi
  6. ≤ 80 x 80mm 9 elementi
  7. ≥ 100 x 100mm 11 elementi
  8. COM Express® 1 elemento
Form Factor Specification
  1. 3,5" 6 elementi
  2. COM Express Compact 1 elemento
  3. Other SBCs 7 elementi
  4. Qseven 70x70 mm 3 elementi
  5. µQseven 70x40 2 elementi
InstallationDepth
  1. 30-35 2 elementi
  2. 35-40 2 elementi
  3. memory ≤4 1 elemento
  4. memory ≤1 2 elementi
  5. memory ≤2 2 elementi
  6. soldered down 2 elementi
Memory
  1. memory ≤1 38 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 33 elementi
  4. memory ≤4 25 elementi
  5. memory ≤8 13 elementi
  6. memory ≥32 1 elemento
  7. soldered down 25 elementi
  8. SO_DIMM 1 elemento
  9. memory ≤32 1 elemento
  10. I2C EEPROM 1 elemento
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 elemento
Mounting Option
  1. VESA Mount 3 elementi
  2. Rear Mount 4 elementi
  3. Panel Mount 3 elementi
  4. Flush Mount 4 elementi
Mass Storage
  1. onboard SSD 1 elemento
  2. I2C EEPROM 1 elemento
  3. microSD card slot 12 elementi
  4. onboard eMMC 2 elementi
  5. onboard eMMC 27 elementi
  6. onboard eMMC 13 elementi
  7. SATA channels ≥ 1 3 elementi
  8. SATA channels ≥ 2 1 elemento
  9. SD interface 10 elementi
  10. SD interface 11 elementi
  11. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 19 elementi
  2. -20°C ÷ +70°C 1 elemento
  3. -40°C ÷ +85°C 25 elementi
  4. 0°C ÷ +50°C 28 elementi
  5. 0°C ÷ +60°C 36 elementi
  6. 20°C ÷ +70°C 16 elementi
  7. -20°C ÷ +70°C 4 elementi
Pci Express
  1. PCI-e lanes ≥ 1 16 elementi
  2. PCI-e lanes ≥ 2 7 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 2 elementi
  5. PCI-e lanes ≥ 5 1 elemento
ScreenDimension
  1. 10-14 1 elemento
  2. 5 elementi
  3. TTL Uarts ≥1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 25 elementi
  2. TTL Uarts ≥2 23 elementi
  3. TTL Uarts ≥3 19 elementi
USB
  1. USB 2.0 ≥ 1 36 elementi
  2. USB 2.0 ≥ 2 31 elementi
  3. USB 2.0 ≥ 3 17 elementi
  4. USB 2.0 ≥ 4 14 elementi
  5. USB 2.0 ≥ 5 7 elementi
  6. USB 2.0 ≥ 6 2 elementi
  7. USB 3.0 ≥ 1 15 elementi
  8. USB 3.0 ≥ 2 11 elementi
  9. USB 3.0 ≥ 4 1 elemento
  10. USB 3.1 ≥ 1 4 elementi
  11. USB OTG 23 elementi
Video Interfaces
  1. DDI 1 elemento
  2. DP 9 elementi
  3. DUAL CHANNEL LVDS 26 elementi
  4. eDP 12 elementi
  5. HDMI 20 elementi
  6. MIPI-CSI camera conn 6 elementi
  7. MIPI-DSI 11 elementi
  8. PARALLEL RGB 4 elementi
  9. SINGLE CHANNEL LVDS 26 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 6 elementi
  2. M.2 SOCKET 2 KEY 5 elementi
  3. M.2 Socket 2 key B 1 elemento
  4. ONBOARD WI-FI/BLE 14 elementi
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
  6. /M/o/Modular_7_ombra_Tavola_disegno_1_1_1.jpg 1 elemento
  7. /s/n/snapdragon-x_per_sito.jpg 1 elemento