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SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)x86 Computer on Module COM-HPC® Processore Intel -
Titan 300 TGL-UP3 AIComputer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPSx86 Processore Intel Fanless Embedded PCs AI-Optimized Hardware -
Palladio 400 RPLPC embedded fanless modulare con processori Intel® Core™ di tredicesima generazionex86 Processore Intel Fanless Embedded PCs -
SOM-SMARC-QCS5430SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 processorArm Computer on Module SMARC® Processore Qualcomm AI-Optimized Hardware -
SOM-SMARC-ASLSMARC® Rel 2.1 compliant module with Intel Atom® Processors x7000RE Series for the Edgex86 Computer on Module SMARC® Processore Intel -
UDOO x86 IISBC based on Intel® Celeron® and Pentium® Applications Processorx86 Processore Intel Single Board Computer Development Kit per POC Single Board Computer Development Kits for Rapid POC