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  1. Memory
    memory ≤32
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Opzioni
Memory
  1. memory ≤1 85 elementi
  2. memory ≤16 32 elementi
  3. memory ≤2 78 elementi
  4. memory ≤4 66 elementi
  5. memory ≤8 56 elementi
  6. memory ≥32 26 elementi
  7. soldered down 55 elementi
  8. SO_DIMM 32 elementi
  9. memory ≤32 1 elemento
  10. I2C EEPROM 1 elemento
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 elemento
Mass Storage
  1. SD interface 1 elemento
  2. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -40°C ÷ +85°C 1 elemento
  2. 0°C ÷ +60°C 1 elemento
USB
  1. USB 2.0 ≥ 5 1 elemento
  2. USB 3.0 ≥ 2 1 elemento
Video Interfaces
  1. DP 1 elemento
  2. DUAL CHANNEL LVDS 1 elemento
  3. MIPI-CSI camera conn 1 elemento
  4. MIPI-DSI 1 elemento
  5. SINGLE CHANNEL LVDS 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution