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6 elementi

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  1. Ethernet
    ETHERNET≥2
  2. Mass Storage
    microSD card slot
  3. Operating Temperature
    -40°C ÷ +85°C
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Arm System ready NXP 1 elemento
  3. Intel 1 elemento
  4. NXP 1 elemento
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 3 elementi
  3. range > 25 W 1 elemento
Cpu Type
  1. AMD Ryzen™ Embedded 1 elemento
  2. AMD® Ryzen™ embedded 1 elemento
  3. Intel® Atom™ 1 elemento
  4. Intel® Celeron® 1 elemento
  5. Intel® Pentium® 1 elemento
  6. NXP i.MX 8M Mini 1 elemento
  7. NXP i.MX8 1 elemento
Ethernet
  1. ETHERNET≥1 9 elementi
  2. ETHERNET≥2 6 elementi
Form Factor
  1. SMARC 2 elementi
  2. Single Board Computer 4 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 elemento
  2. ≤ 80 x 80mm 1 elemento
  3. ≥ 100 x 100mm 4 elementi
Form Factor Specification
  1. 3,5" 3 elementi
  2. Pico-ITX 1 elemento
Memory
  1. memory ≤1 4 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 4 elementi
  4. memory ≤4 4 elementi
  5. memory ≤8 3 elementi
  6. memory ≥32 1 elemento
  7. soldered down 3 elementi
  8. SO_DIMM 1 elemento
Mass Storage
  1. onboard SSD 2 elementi
  2. standard SATA connector 3 elementi
  3. I2C EEPROM 1 elemento
  4. M.2 NVMe SSD slot 4 elementi
  5. M.2 SATA SSD slot 8 elementi
  6. microSD card slot 6 elementi
  7. onboard eMMC 1 elemento
  8. onboard eMMC 13 elementi
  9. onboard eMMC 1 elemento
  10. SATA channels ≥ 1 9 elementi
  11. SATA channels ≥ 1 1 elemento
  12. SATA channels ≥ 2 3 elementi
  13. SATA channels ≥ 2 3 elementi
  14. SD interface 5 elementi
  15. SD interface 2 elementi
  16. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
  17. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 5 elementi
  2. -40°C ÷ +85°C 6 elementi
  3. 0°C ÷ +50°C 8 elementi
  4. 0°C ÷ +60°C 7 elementi
  5. 20°C ÷ +70°C 5 elementi
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 2 elementi
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 2 elementi
  2. TTL Uarts ≥2 2 elementi
  3. TTL Uarts ≥3 2 elementi
USB
  1. USB 2.0 ≥ 1 6 elementi
  2. USB 2.0 ≥ 2 3 elementi
  3. USB 2.0 ≥ 3 3 elementi
  4. USB 2.0 ≥ 4 2 elementi
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 3.0 ≥ 1 4 elementi
  7. USB 3.0 ≥ 2 3 elementi
  8. USB 3.0 ≥ 3 1 elemento
  9. USB 3.1 ≥ 1 1 elemento
  10. USB OTG 4 elementi
Video Interfaces
  1. DP 1 elemento
  2. DP++ 3 elementi
  3. DUAL CHANNEL LVDS 5 elementi
  4. eDP 3 elementi
  5. HDMI 4 elementi
  6. MIPI-CSI camera conn 2 elementi
  7. SINGLE CHANNEL LVDS 3 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 elementi
  2. M.2 SOCKET 2 KEY 2 elementi
  3. M.2 Socket 2 key B 1 elemento
  4. ONBOARD WI-FI/BLE 2 elementi
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution