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3.5-inch SBC

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SBC-3.5-TGL-UP3

SBC-3.5-TGL-UP3

SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)

SBC-3.5-RV1000

SBC-3.5-RV1000

3.5" SBC mit AMD Ryzen™ Embedded R1000 / V1000 Familie von SOCs. (MERIDA - C90)

SBC-3.5-RK3568

SBC-3.5-RK3568

3.5” SBC mit Rockchip RK3568 SoC. (SAYLOR - E09)

SBC-3.5-RK3399

SBC-3.5-RK3399

3.5” SBC mit Rockchip RK3399 SoC.(SOLON - C31)

SBC-3.5-MX8X

SBC-3.5-MX8X

3.5” SBC mit NXP i.MX 8X Anwendungsprozessor. (VESTA - C57)

3.5-inch SBC

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    PCI-e lanes ≥ 1
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  1. AMD 1 item
  2. NXP 2 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 2 items
  3. range > 25 W 1 item
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. NXP i.MX 8X 1 item
  4. NXP i.MX8 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 3 items
Memory
  1. memory ≤1 3 items
  2. memory ≤16 1 item
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. memory ≤8 2 items
  6. memory ≥32 1 item
  7. soldered down 2 items
  8. SO_DIMM 1 item
Mass Storage
  1. M.2 NVMe SSD slot 1 item
  2. microSD card slot 2 items
  3. onboard eMMC 2 items
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 1 item
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 1 item
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 1 3 items
  7. USB 3.0 ≥ 2 1 item
  8. USB 3.0 ≥ 3 1 item
  9. USB OTG 2 items
Video Interfaces
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  2. DUAL CHANNEL LVDS 2 items
  3. eDP 3 items
  4. HDMI 1 item
  5. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
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  2. M.2 SOCKET 2 KEY 2 items
  3. ONBOARD WI-FI/BLE 2 items