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Lüfterlose Embedded PCs

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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

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Modular Link IQ-615

DIN Mount Industrial Gateway with the Qualcomm® IQ-615 SoC

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

Titan 300 TGL-UP3

Titan 300 TGL-UP3

Lüfterloser Embedded-Computer mit den Intel® Core™ und Intel® Celeron® SoCs der 11. Generation (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Titan 290 EHL

Titan 290 EHL

Lüfterloser Embedded-Computer mit Intel® Atom® X6000E-Serie, Intel® Pentium® und Celeron® N- und J-Serie (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)

Lüfterlose Embedded PCs

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  1. Intel 3 items
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Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 4 items
Cpu Type
  1. Espressif ESP32-D0WD 1 item
  2. Intel® Atom™ 2 items
  3. Intel® Celeron® 1 item
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  5. NXP i.MX 8M 1 item
Ethernet
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  2. ETHERNET≥2 3 items
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  2. Boxed Solutions 5 items
Form Factor Dimensions
  1. ≥ 100 x 100mm 5 items
Form Factor Specification
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Memory
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  2. memory ≤2 4 items
  3. memory ≤4 3 items
  4. memory ≤8 3 items
  5. soldered down 5 items
Mass Storage
  1. onboard SSD 1 item
  2. M.2 SATA SSD slot 2 items
  3. microSD card slot 1 item
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  5. onboard eMMC 1 item
  6. SATA channels ≥ 1 2 items
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  2. 0°C ÷ +60°C 2 items
Ttl Uarts
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USB
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  2. USB 2.0 ≥ 2 3 items
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  4. USB 3.0 ≥ 2 2 items
Video Interfaces
  1. DP 2 items
  2. DP++ 3 items
  3. HDMI 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. M.2 SOCKET 2 KEY 2 items
  3. M.2 Socket 2 key B 4 items
  4. ONBOARD WI-FI/BLE 2 items