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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Boxed solution basierend auf dem Rockchip RK3399 Anwendungsprozessor. (PICTOR - SYS-C31-IPC)

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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. MediaTek 1 item
  4. NXP 8 items
  5. Qualcomm 4 items
  6. Rockchip 3 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 5 items
  3. range < 5 W 1 item
Cpu Type
  1. NXP i.MX 8M Mini 1 item
  2. NXP i.MX 8M Plus 2 items
  3. NXP i.MX 8X 2 items
  4. NXP i.MX 933/935 1 item
  5. NXP i.MX 95 1 item
  6. NXP i.MX6 1 item
  7. NXP i.MX8 1 item
  8. Qualcomm® QCS5430 1 item
  9. Qualcomm® QCS6490 1 item
  10. Rockchip RK3399 2 items
  11. Rockchip RK3568 1 item
  12. Zynq® Ultras 1 item
  13. Qualcomm Dragonwing IQ-X 1 item
  14. MediaTek Genio360 1 item
  15. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 39 items
  2. ETHERNET≥2 18 items
Form Factor
  1. COM Express® 1 item
  2. SMARC 8 items
  3. Trizeps SODIMM SOM 2 items
  4. Boxed Solutions 1 item
  5. Single Board Computer 6 items
Form Factor Dimensions
  1. 67,6 x 36,7 mm 2 items
  2. ≤ 100 x 100mm 7 items
  3. ≤ 80 x 80mm 4 items
  4. ≥ 100 x 100mm 5 items
  5. COM Express® 1 item
Form Factor Specification
  1. 3,5" 5 items
  2. Other SBCs 1 item
Memory
  1. memory ≤1 15 items
  2. memory ≤16 1 item
  3. memory ≤2 15 items
  4. memory ≤4 14 items
  5. memory ≤8 6 items
  6. soldered down 13 items
  7. memory ≤32 1 item
  8. I2C EEPROM 1 item
  9. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. microSD card slot 4 items
  3. onboard eMMC 1 item
  4. onboard eMMC 11 items
  5. onboard eMMC 4 items
  6. SATA channels ≥ 1 1 item
  7. SD interface 4 items
  8. SD interface 5 items
  9. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  10. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 10 items
  2. -40°C ÷ +85°C 12 items
  3. 0°C ÷ +50°C 13 items
  4. 0°C ÷ +60°C 15 items
  5. 20°C ÷ +70°C 9 items
  6. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 8 items
  2. PCI-e lanes ≥ 2 5 items
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 2 items
Ttl Uarts
  1. TTL Uarts ≥1 12 items
  2. TTL Uarts ≥2 11 items
  3. TTL Uarts ≥3 10 items
USB
  1. USB 2.0 ≥ 1 12 items
  2. USB 2.0 ≥ 2 12 items
  3. USB 2.0 ≥ 3 9 items
  4. USB 2.0 ≥ 4 7 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 9 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.1 ≥ 1 2 items
  10. USB OTG 8 items
Video Interfaces
  1. DP 5 items
  2. DUAL CHANNEL LVDS 12 items
  3. eDP 8 items
  4. HDMI 8 items
  5. MIPI-CSI camera conn 3 items
  6. MIPI-DSI 7 items
  7. PARALLEL RGB 2 items
  8. SINGLE CHANNEL LVDS 13 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 items
  2. M.2 SOCKET 2 KEY 2 items
  3. ONBOARD WI-FI/BLE 8 items
  4. /s/n/snapdragon-x_per_sito.jpg 1 item