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SOM-COMe-CT6-Dragonwing-IQ-X
Höhepunkte
Graphics Qualcomm® Adreno™ GPU, up to 3.8 TFLOPS
Memory Up to 64GB LPDDR5-4224 integrated on SiP
Connectivity 1× NBase-T Ethernet
Entdecken Sie unsere Kits
Kit di Valutazione Engineering Sample (ES1)
Prova la prima versione Engineering Sample (ES1) del SOM-COMe-CT6-Dragonwing-IQ-X con il kit di valutazione dedicato. Il kit è progettato per consentirti di avviare il sistema in pochi minuti, iniziare lo sviluppo nelle fasi iniziali e verificare lo stato attuale delle I/O supportate (incluse le limitazioni note per ES1).
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
Beschreibung
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COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. F31 |
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CPU Description
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Qualcomm® Dragonwing™ IQ-X Series of processors in SiP-A Dragonwing™ IQ-X7181MD: Custom Oryon™ 12-core CPU up to 3.4GHz Dragonwing™ IQ-X5121MD: Custom Oryon™ 8-core CPU up to 3.4GHz |
Memory Description
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Up to 64GB LPDDR5 4224MT/s integrated on SiP |
Graphics Description
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Qualcomm® Adreno™ GPU: IQ-X7181MD: 1.25GHz GPU IQ-X5121MD: 1.1GHz GPU |
Video Interfaces Description
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Up to 4 independent displays 2x DP supporting DP / DP Alt Mode overType-C 1x DDI supporting DP 1x eDP or 1 x LVDS |
Video Resolution Description
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DP: up to 5120x2880 @60Hz eDP up to 4K60Hz LVDS up to 1920x1200 @ 60Hz Max resolution 5120 × 2880p60 + 4096 × 2160p60 + 4096 × 2160p60 across all display outputs. |
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Mass Storage Description
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UFS 4.0 module on-board, optional, up to 1 TB microSD card slot I2C EEPROM |
Networking Description
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1x NBase-T Ethernet port with Time-Sensitive Networking, supporting 10/100/1000/2500Mbp UFS 4.0 module on-board, optional, up to 1 TB microSD card slot I2C EEPROM Realtek RTL8125 i RTL8111k |
USB Description
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2x USB 10Gbps interfaces (without USB hub) 1x USB 10Gbps + 3xUSB 5Gbps (with USB hub) 8x Hi-Speed USB 2x USB4 Gen3x2 ports |
PCI Description
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2x PCI-e x2 or 1x PCI-e x4 Gen4 port 1x PCI-e x2 Gen3 lport 1x PCI-e x8 Gen4 port on PEG pins |
Audio Description
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I2S audio interface on pins demanded to HD audio Soundwire interface |
Serial Ports
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Up to 2x 2-wires UARTs CAN port (optional) |
Other Interfaces
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Boot SPI General purpose SPI QSPI on LPC/eSPI 2x I2C Bus 4x GPIs 4x GPOs Optional TPM 2.0 on-board |
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Power Supply
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+12VDC ± 10%, +5V StandBy, +3.0VRTC |
Operating System
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Microsoft® Windows 11 IoT Enterprise Yocto Linux |
Operating Temperature Description
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0° ÷ +60°C (Commercial Version) -40C ÷ +85°C (Industrial Version) |
Dimensions
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95x95mm (COM Express Compact Form Factor) |