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SOM-SMARC-TWLSMARC® Rel. 2.1 compliant module mit Intel® Intel® Core™ i3 Prozessor, Intel® Prozessoren N Series (Codename: Twin Lake). (E08)Computer on Module SMARC® Intel Prozessor -
Titan 300 TGL-UP3Lüfterloser Embedded-Computer mit den Intel® Core™ und Intel® Celeron® SoCs der 11. Generation (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel Prozessor Lüfterlose Embedded PCs -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, mit 13th Gen Intel® Core™-Prozessoren (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 Computer on Module COM-HPC® Intel Prozessor AI-Optimized Hardware -
SBC-3.5-TGL-UP3SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)Intel Prozessor Single Board Computer 3.5-inch SBC -
SBC-3.5-RV10003.5" SBC mit AMD Ryzen™ Embedded R1000 / V1000 Familie von SOCs. (MERIDA - C90)Single Board Computer 3.5-inch SBC -
Krater RV1000Boxed für Digital Signage-Anwendungen mit AMD Ryzen™ Embedded R1000 / V1000 SOC-Familie. (KRATER - SYS-C90-DS)Industrielle Embedded PCs