SOM-Trizeps-VIII-MX8M-Plus

SODIMM-200 CPU Computer on Module (CoM) with NXP i.MX 8M Plus Applications Processors (Trizeps VIII Plus)

Available in Industrial Temperature Range

Data sheet

Wiki

Cpu

NXP i.MX8M Plus Applications Processors

Graphics

Integrated GPU with multi display support GC520L 2D accelerator + GC7000UL 3D accelerator

Connectivity

2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/BT

Memory

Up to 8 GB LPDDR4-4000 memory

Product details

Technical Info

Description	The new SOM-Trizeps-VIII-MX8M-Plus CPU Computer on Module (CoM) uses the new i.MX 8M Plus processor from the NXP i.MX8 series. The i.MX 8M Plus SoC (System on Chip) has various processor units that can handle a wide range of computing operations. Of particular note is the NPU (Neural Processing Unit), which can handle computational processes in the field of AI (Artificial Intelligence) typically with learned neural networks. These can be used for pattern, speech and object recognition. and object recognition. This opens up new areas of application for the SOM-Trizeps-VIII-MX8M-Plus (System On Module). Equally important is the wide range of applications for the classic embedded functions. This is where the Dual Gigabit Ethernet and Dual CAN FD interfaces, which are used e.g. in industrial automation, are convincing. ""Low power"" applications or real-time applications can be provided by the integrated 800 MHz clocked Arm Cortex-M7 co-processor. USB 3.0 and PCIe are available as high-speed interfaces. The SOM-Trizeps-VIII-MX8M-Plus can also be used for a wide range of multimedia applications. Fast image processing is enabled by high-performance video decoders and encoders as well as two image signal processors (Dual-ISP - Dual Image Signal Processor). Also, powerful audio and voice functions are available. Displays can be connected via HDMI, (dual-)LVDS or MIPI-DISI interfaces. Besides, the Trizeps VIII Plus extends the functionality of the i.MX 8M Plus SoC with the configurable FPGA, the programmable Kinetis Cortex M0+ MCU, the HiFi Audio Codec and the WLAN/BT module.
Cpu	NXP i.MX 8M Plus family SoCs: Dual or Quad Arm® Cortex®-A53 Cores + general purpose Cortex® M7 800MHz processor • NXP i.MX 8M Plus Quad, 4x Arm® Cortex®-A53 Cores up to 1.8GHz • NXP i.MX 8M Plus Dual, 2x Arm® Cortex®-A53 Cores up to 1.8GH NPU: 2.3 TOPS Neural Network performance (not for Quad Lite) Optional: NXP™ Kinetis V Arm® Cortex-M0+ up to 75 MHz / 8x 16 Bit ADC, UART, SPI, GPIO, I2C Optional: Programmable FPGA, up to 4300 LUTs
Memory	Soldered down LPDDR4-4000 memory, 32-bit interface, up to 8GB
Graphics	Integrated Graphics Processing Unit GC7000UL, supports 3 independent displays. Embedded VPU, supports HW decoding of HEVC/H.265, AVC/H.264, MPEG-4, MPEG-2, MVC, VC-1, RV, VP6, VP7, VP8, VP9, JPEG, HW encoding of HEVC/H.265, AVC/H.264 Supports OpenVG 1.1, OpenGL ES 3.1, OpenCL 1.2 Full Profile and Vulkan
Video Interfaces	HDMI®, MIPI display (4 channel) / Single- or Dual-LVDS, LCD 24 Bit RGB
Video Resolution	HDMI®, LVDS, eDP: Up to 1920 x 1080p @60 Video-Decoder: 1080p60, h.265/4, VP9, VP8 / Video Encoder: 1080p60, h.265/4
Mass Storage	Onboard 4 Bit wide μSD Card Socket or onboard 8 Bit wide eMMC
Networking	2x Gigabit Ethernet (1x RGMII PHY and 1x RGMII interface) Optional: WiFi 802.11 a/b/g/n/ac 2x2 MU-MIMO / BT 4.2/5.0
Usb	2x USB 3.0 OTG
Pci	Up to 1x PCI-e x1 Gen3 port
Audio	Digital: 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8 channel PDM Microphone input Analog: Stereo Headphone output, Mono Speaker output, Stereo Line-In, Microphone input
Serial Ports	4x UART
Other Interfaces	3x 4 Bit wide SDIO 3.0 SPDIF In/Out I2S Multichannel Serial-Audio-Interface 2x I2C SPI QSPI GPIOs PWMs 2x CAN
Power Supply	3.3 VDC
Operating System	Linux Yocto, Debian / Android / Windows 10 IoT
Operating Temperature	-40 ÷ 85°C (industrial) / -25 ÷ 85°C (Extended Consumer) / 0 ÷ 70°C (Consumer)
Dimensions	67.6 x 36.7 x 6.4 mm