SOM-SMARC-MX93

SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors. (MAURY)

Available in Industrial Temperature Range

Cpu

NXP i.MX 933/935 processor On request also available with NXP i.MX 91 with reduced functionalities

Graphics

Display up to FHD

Connectivity

2x GB Ethernet, 1x USB 2.0 OTG, up to 4x USB 2.0, 2x CAN, 4 x UART, opt Wi-Fi +BT 5.0, MIPI-CSI, 1x I2S

Memory

Soldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total, 16-bit interface

Description	SMARC® Rel. 2.1.1 Computer on Module (CoM) with NXP i.MX 9 Applications Processors
Cpu	1-2x Arm® Cortex®-A55 @ 1.7 GHz Arm Cortex-M33 @ 250Mhz Arm® Ethos™ U-65 microNPU
Memory	Soldered-down LPDDR4X/LPDDR4-3200 memory, up to 2GB total, 16-bit interface
Graphics	LVDS Single Channel MIPI_DSI or eDP interface (factory alternatives)
Video Interfaces	LVDS Single Channel MIPI_DSI or eDP interface (factory alternatives)
Video Resolution	MIPI-DSI: up to 1080p60 LVDS: up to 720p60
Mass Storage	eMMC 5.1 Drive soldered on-board, up to 64GB (boot device) SD 4-bit interface (boot device)
Networking	2x Gigabit Ethernet interfaces, opt. Wi-Fi + BT5.0
Usb	1x USB 2.0 OTG port up to 4x USB 2.0 using optional internal 2.0 HUB
Audio	1x I2S port
Serial Ports	2x UART (4-wires) 2x UART (2-wires)
Other Interfaces	12 x GPIOs 1x MIPI-CSI 2 Lanes Camera interface 1x General Purpose I2C Bus 2 x PWM ports
Security	TPM
Embedded Controller Functionalities	Power management Watchdog Boot select signals GP I/O
Power Supply	+5VDC ± 5% and +3.3V_RTC
Operating System	Linux Yocto
Operating Temperature	0 to +60°C (Commercial Range) -40 to +85°C (Industrial Range) *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	82 x 50 mm