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Processore Intel

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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

Processore Intel

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  1. Memory
    memory ≥32
  2. Mass Storage
    M.2 SATA SSD slot
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Opzioni
Cpu Type
  1. Intel® Celeron® 1 elemento
  2. Intel® Core™ 6 elementi
Ethernet
  1. ETHERNET≥1 5 elementi
  2. ETHERNET≥2 4 elementi
Form Factor
  1. COM Express® 2 elementi
  2. Boxed Solutions 3 elementi
  3. Single Board Computer 1 elemento
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 elementi
Form Factor Specification
  1. 3,5" 1 elemento
  2. COM Express Basic 2 elementi
Memory
  1. memory ≤1 8 elementi
  2. memory ≤16 5 elementi
  3. memory ≤2 9 elementi
  4. memory ≤4 8 elementi
  5. memory ≤8 11 elementi
  6. memory ≥32 6 elementi
  7. soldered down 9 elementi
  8. SO_DIMM 5 elementi
Mass Storage
  1. CFAST slot 1 elemento
  2. M.2 NVMe SSD slot 6 elementi
  3. M.2 SATA SSD slot 6 elementi
  4. microSD card slot 1 elemento
  5. onboard eMMC 3 elementi
  6. SATA channels ≥ 1 11 elementi
  7. SATA channels ≥ 2 1 elemento
  8. SATA channels ≥ 2 1 elemento
  9. SATA channels ≥ 2 12 elementi
  10. SATA channels ≥ 3 6 elementi
  11. SATA channels ≥ 4 4 elementi
  12. SD interface 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 3 elementi
  2. -20°C ÷ +70°C 2 elementi
  3. -40°C ÷ +85°C 1 elemento
  4. 0°C ÷ +50°C 3 elementi
  5. 0°C ÷ +60°C 6 elementi
  6. 20°C ÷ +70°C 3 elementi
  7. -20°C ÷ +70°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
  3. PCI-e lanes ≥ 4 1 elemento
  4. PCI-e lanes ≥ 5 2 elementi
Ttl Uarts
  1. TTL Uarts ≥2 1 elemento
USB
  1. USB 2.0 ≥ 2 1 elemento
  2. USB 3.2 ≥ 1 3 elementi
  3. USB 3.2 ≥ 2 3 elementi
  4. USB 4.0 ≥ 2 2 elementi
  5. USB OTG 2 elementi
Video Interfaces
  1. DDI 2 elementi
  2. DP 3 elementi
  3. DP++ 1 elemento
  4. DUAL CHANNEL LVDS 3 elementi
  5. eDP 2 elementi
  6. HDMI 2 elementi
  7. MIPI-CSI camera conn 2 elementi
  8. SINGLE CHANNEL LVDS 1 elemento
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 elementi
  2. M.2 Socket 2 key B 1 elemento