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3 elementi

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  1. Wireless Connectivity
    ONBOARD WI-FI/BLE
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Opzioni
Cpu Maker
  1. Qualcomm 1 elemento
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range < 10 W 1 elemento
  3. range < 5 W 1 elemento
  4. range > 25 W 1 elemento
Cpu Type
  1. Qualcomm® QCS6490 1 elemento
Ethernet
  1. ETHERNET≥2 2 elementi
Form Factor
  1. SMARC 1 elemento
  2. Trizeps SODIMM SOM 2 elementi
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 elemento
Memory
  1. soldered down 1 elemento
Mass Storage
  1. onboard eMMC 1 elemento
  2. SD interface 1 elemento
  3. SD interface 2 elementi
Operating Temperature
  1. 0°C ÷ +60°C 1 elemento
  2. -20°C ÷ +70°C 2 elementi
Ttl Uarts
  1. TTL Uarts ≥2 1 elemento
  2. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 2 elementi
  2. USB 2.0 ≥ 4 1 elemento
  3. USB 3.1 ≥ 1 1 elemento
  4. USB OTG 2 elementi
Video Interfaces
  1. DP 1 elemento
  2. DUAL CHANNEL LVDS 2 elementi
  3. HDMI 1 elemento
  4. PARALLEL RGB 2 elementi
  5. SINGLE CHANNEL LVDS 3 elementi
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 3 elementi
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