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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

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  1. Video Interfaces
    DP
  2. Wireless Connectivity
    M.2 SOCKET 1 KEY
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Intel 4 elementi
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range < 10 W 2 elementi
Cpu Type
  1. Espressif ESP32-D0WD 1 elemento
  2. Intel® Atom™ 2 elementi
  3. Intel® Core™ 2 elementi
Ethernet
  1. ETHERNET≥1 5 elementi
  2. ETHERNET≥2 4 elementi
Form Factor
  1. Single Board Compute 1 elemento
  2. Boxed Solutions 4 elementi
Form Factor Dimensions
  1. ≥ 100 x 100mm 3 elementi
Form Factor Specification
  1. Other SBCs 1 elemento
Memory
  1. memory ≤1 4 elementi
  2. memory ≤16 2 elementi
  3. memory ≤2 4 elementi
  4. memory ≤4 4 elementi
  5. memory ≤8 4 elementi
  6. memory ≥32 2 elementi
  7. soldered down 2 elementi
  8. SO_DIMM 3 elementi
Mass Storage
  1. onboard SSD 1 elemento
  2. M.2 NVMe SSD slot 1 elemento
  3. M.2 SATA SSD slot 5 elementi
  4. onboard eMMC 1 elemento
  5. onboard eMMC 1 elemento
  6. SATA channels ≥ 1 4 elementi
  7. SATA channels ≥ 2 2 elementi
  8. SATA channels ≥ 3 2 elementi
  9. SATA channels ≥ 4 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 2 elementi
  2. -20°C ÷ +70°C 2 elementi
  3. 0°C ÷ +50°C 4 elementi
  4. 0°C ÷ +60°C 4 elementi
  5. 20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
Ttl Uarts
  1. TTL Uarts ≥2 1 elemento
USB
  1. USB 2.0 ≥ 1 2 elementi
  2. USB 2.0 ≥ 2 1 elemento
  3. USB 3.0 ≥ 1 2 elementi
  4. USB 3.0 ≥ 2 2 elementi
  5. USB 3.2 ≥ 1 2 elementi
  6. USB 3.2 ≥ 2 2 elementi
Video Interfaces
  1. DP 5 elementi
  2. DP++ 6 elementi
  3. DUAL CHANNEL LVDS 1 elemento
  4. HDMI 4 elementi
  5. SINGLE CHANNEL LVDS 1 elemento
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 elementi
  2. M.2 SOCKET 2 KEY 1 elemento
  3. M.2 Socket 2 key B 4 elementi