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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

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  1. Form Factor Dimensions
    40x70 mm (µQseven, 1.57"x 2.76")
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Opzioni
Cpu Type
  1. Intel® Atom™ 1 elemento
  2. Intel® Celeron® 1 elemento
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 elementi
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 elemento
  3. ≤ 100 x 100mm 23 elementi
  4. ≤ 80 x 80mm 7 elementi
  5. ≥ 100 x 100mm 10 elementi
  6. COM Express® 2 elementi
Memory
  1. memory ≤1 1 elemento
  2. memory ≤2 1 elemento
  3. memory ≤4 1 elemento
  4. soldered down 1 elemento
Mass Storage
  1. onboard eMMC 1 elemento
  2. SATA channels ≥ 1 1 elemento
  3. SATA channels ≥ 2 1 elemento
  4. SD interface 1 elemento
Operating Temperature
  1. 0°C ÷ +50°C 1 elemento
  2. 0°C ÷ +60°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 3 1 elemento
USB
  1. USB 2.0 ≥ 1 1 elemento
  2. USB 2.0 ≥ 2 1 elemento
  3. USB 2.0 ≥ 3 1 elemento
  4. USB 2.0 ≥ 4 1 elemento
  5. USB 3.0 ≥ 1 1 elemento
Video Interfaces
  1. DP++ 1 elemento
  2. SINGLE CHANNEL LVDS 1 elemento