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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Computer embedded senza ventola con processori Intel® Core™ di 11a generazione e Intel® Celeron® SoCs (Codename: Tiger Lake UP3). Dotato di un chip Axelera AI: alimentato da un singolo Metis AIPU fino a 120 TOPS

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  1. Ethernet
    ETHERNET≥2
  2. Memory
    memory ≥32
  3. Operating Temperature
    20°C ÷ +70°C
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Intel 2 elementi
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range > 25 W 1 elemento
Cpu Type
  1. AMD EPYC™ Embedded 3 1 elemento
  2. Intel® Core™ 2 elementi
Ethernet
  1. ETHERNET≥1 6 elementi
  2. ETHERNET≥2 3 elementi
Form Factor
  1. COM Express® 1 elemento
  2. Boxed Solutions 2 elementi
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 elemento
Form Factor Specification
  1. COM Express Basic 1 elemento
Memory
  1. memory ≤1 7 elementi
  2. memory ≤16 4 elementi
  3. memory ≤2 7 elementi
  4. memory ≤4 7 elementi
  5. memory ≤8 7 elementi
  6. memory ≥32 3 elementi
  7. soldered down 4 elementi
  8. SO_DIMM 3 elementi
Mass Storage
  1. M.2 SATA SSD slot 2 elementi
  2. SATA channels ≥ 1 3 elementi
  3. SATA channels ≥ 2 3 elementi
  4. SATA channels ≥ 3 2 elementi
  5. SATA channels ≥ 4 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 3 elementi
  2. -20°C ÷ +70°C 2 elementi
  3. -40°C ÷ +85°C 2 elementi
  4. 0°C ÷ +50°C 4 elementi
  5. 0°C ÷ +60°C 4 elementi
  6. 20°C ÷ +70°C 3 elementi
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 1 elemento
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 1 elemento
  2. TTL Uarts ≥2 1 elemento
USB
  1. USB 3.1 ≥ 1 1 elemento
  2. USB 3.1 ≥ 2 1 elemento
  3. USB 3.2 ≥ 1 2 elementi
  4. USB 3.2 ≥ 2 2 elementi
Video Interfaces
  1. DP 2 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 elementi