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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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3 elementi

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  1. Ttl Uarts
    TTL Uarts ≥3
  2. USB
    USB 2.0 ≥ 4
  3. Video Interfaces
    eDP
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Opzioni
Cpu Maker
  1. Arm System ready NXP 1 elemento
  2. MediaTek 1 elemento
  3. NXP 1 elemento
Cpu Power Consumption
  1. range < 10 W 2 elementi
Cpu Type
  1. MediaTek Genio 510 1 elemento
  2. NXP i.MX 8M Mini 1 elemento
  3. NXP i.MX8 1 elemento
Ethernet
  1. ETHERNET≥1 3 elementi
  2. ETHERNET≥2 2 elementi
Form Factor
  1. SMARC 1 elemento
  2. Single Board Computer 2 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 elemento
  2. ≥ 100 x 100mm 2 elementi
Form Factor Specification
  1. 3,5" 2 elementi
Memory
  1. memory ≤1 3 elementi
  2. memory ≤2 3 elementi
  3. memory ≤4 3 elementi
  4. memory ≤8 2 elementi
  5. soldered down 3 elementi
Mass Storage
  1. microSD card slot 2 elementi
  2. onboard eMMC 3 elementi
Operating Temperature
  1. -20°C ÷ +60°C 3 elementi
  2. -20°C ÷ +70°C 1 elemento
  3. -40°C ÷ +85°C 3 elementi
  4. 0°C ÷ +50°C 3 elementi
  5. 0°C ÷ +60°C 3 elementi
  6. 20°C ÷ +70°C 3 elementi
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 8 elementi
  2. TTL Uarts ≥2 7 elementi
  3. TTL Uarts ≥3 3 elementi
USB
  1. USB 2.0 ≥ 1 5 elementi
  2. USB 2.0 ≥ 2 5 elementi
  3. USB 2.0 ≥ 3 5 elementi
  4. USB 2.0 ≥ 4 3 elementi
  5. USB 2.0 ≥ 5 2 elementi
  6. USB 3.0 ≥ 1 3 elementi
  7. USB 3.0 ≥ 2 1 elemento
  8. USB 3.1 ≥ 1 1 elemento
  9. USB OTG 3 elementi
Video Interfaces
  1. DP 1 elemento
  2. DUAL CHANNEL LVDS 3 elementi
  3. eDP 3 elementi
  4. HDMI 2 elementi
  5. MIPI-CSI camera conn 1 elemento
  6. MIPI-DSI 1 elemento
  7. SINGLE CHANNEL LVDS 3 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 elementi
  2. M.2 SOCKET 2 KEY 1 elemento
  3. ONBOARD WI-FI/BLE 2 elementi