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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.2 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

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Filtri attivi
  1. Mass Storage
    microSD card slot
  2. Pci Express
    PCI-e lanes ≥ 1
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Opzioni
Cpu Maker
  1. NXP 3 elementi
  2. Raspberry Pi 1 elemento
Cpu Power Consumption
  1. range < 10 W 3 elementi
Cpu Type
  1. NXP i.MX 8M 1 elemento
  2. NXP i.MX6 1 elemento
  3. NXP i.MX8 1 elemento
Ethernet
  1. ETHERNET≥1 3 elementi
  2. ETHERNET≥2 1 elemento
Form Factor
  1. Qseven 2 elementi
  2. Modular HMIs 1 elemento
  3. Single Board Computer 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. ≤ 80 x 80mm 2 elementi
  3. ≥ 100 x 100mm 1 elemento
Form Factor Specification
  1. 3,5" 1 elemento
  2. Qseven 70x70 mm 2 elementi
Memory
  1. memory ≤1 3 elementi
  2. memory ≤2 3 elementi
  3. memory ≤4 3 elementi
  4. memory ≤8 2 elementi
  5. soldered down 3 elementi
Mounting Option
  1. VESA Mount 1 elemento
  2. Rear Mount 1 elemento
  3. Panel Mount 1 elemento
  4. Flush Mount 1 elemento
Mass Storage
  1. onboard SSD 1 elemento
  2. microSD card slot 4 elementi
  3. onboard eMMC 13 elementi
  4. onboard eMMC 3 elementi
  5. SATA channels ≥ 1 3 elementi
  6. SD interface 8 elementi
  7. SD interface 3 elementi
Operating Temperature
  1. -20°C ÷ +60°C 3 elementi
  2. -40°C ÷ +85°C 3 elementi
  3. 0°C ÷ +50°C 3 elementi
  4. 0°C ÷ +60°C 4 elementi
  5. 20°C ÷ +70°C 3 elementi
Pci Express
  1. PCI-e lanes ≥ 1 4 elementi
  2. PCI-e lanes ≥ 2 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 3 elementi
  2. TTL Uarts ≥2 3 elementi
  3. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 3 elementi
  2. USB 2.0 ≥ 2 3 elementi
  3. USB 2.0 ≥ 3 3 elementi
  4. USB 2.0 ≥ 4 3 elementi
  5. USB 2.0 ≥ 5 2 elementi
  6. USB 3.0 ≥ 1 2 elementi
  7. USB 3.0 ≥ 2 1 elemento
  8. USB OTG 3 elementi
Video Interfaces
  1. DP 1 elemento
  2. DUAL CHANNEL LVDS 3 elementi
  3. eDP 2 elementi
  4. HDMI 3 elementi
  5. MIPI-CSI camera conn 1 elemento
  6. SINGLE CHANNEL LVDS 3 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 elemento
  2. M.2 SOCKET 2 KEY 1 elemento
  3. ONBOARD WI-FI/BLE 2 elementi