Menu
Account
Arm

Ultimi prodotti

SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Computer embedded senza ventola basato sul processore Rockchip RK3399. (PICTOR - SYS-C31-IPC)

Arm

Naviga per
Cancella tutto

2 elementi

Imposta la direzione decrescente
per pagina
Naviga per
Filtri attivi
  1. Cpu Maker
    AMD
Cancella tutto
Opzioni
Cpu Maker
  1. AMD 2 elementi
  2. Arm System ready NXP 1 elemento
  3. MediaTek 3 elementi
  4. NXP 31 elementi
  5. Qualcomm 4 elementi
  6. Rockchip 3 elementi
  7. Raspberry Pi 1 elemento
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 1 elemento
  3. range > 25 W 1 elemento
Cpu Type
  1. AMD® Ryzen™ embedded 1 elemento
  2. Zynq® Ultras 1 elemento
Ethernet
  1. ETHERNET≥1 2 elementi
  2. ETHERNET≥2 1 elemento
Form Factor
  1. COM Express® 1 elemento
  2. SMARC 1 elemento
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 elementi
  2. ≤ 80 x 80mm 1 elemento
Form Factor Specification
  1. COM Express Compact 1 elemento
Memory
  1. memory ≤1 1 elemento
  2. memory ≤2 1 elemento
  3. memory ≤4 1 elemento
  4. memory ≤8 1 elemento
  5. memory ≥32 1 elemento
  6. soldered down 1 elemento
  7. SO_DIMM 1 elemento
Mass Storage
  1. onboard eMMC 1 elemento
  2. SATA channels ≥ 1 1 elemento
  3. SATA channels ≥ 2 1 elemento
  4. SD interface 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 1 elemento
  2. -40°C ÷ +85°C 1 elemento
  3. 0°C ÷ +50°C 1 elemento
  4. 0°C ÷ +60°C 2 elementi
  5. 20°C ÷ +70°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 1 elemento
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 1 elemento
  2. TTL Uarts ≥2 2 elementi
  3. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 1 elemento
  2. USB 2.0 ≥ 2 1 elemento
  3. USB 2.0 ≥ 3 1 elemento
  4. USB 2.0 ≥ 6 1 elemento
  5. USB 3.0 ≥ 1 1 elemento
  6. USB 3.0 ≥ 2 1 elemento
  7. USB 3.0 ≥ 4 1 elemento
  8. USB OTG 1 elemento
Video Interfaces
  1. DDI 1 elemento
  2. DP 2 elementi
  3. DUAL CHANNEL LVDS 2 elementi
  4. eDP 1 elemento
  5. HDMI 1 elemento
  6. SINGLE CHANNEL LVDS 2 elementi