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SOM-SMARC-ADL-NComputer on Module (CoM) SMARC® Rel. 2.1.1 con processori Intel® Atom® serie x7000E, Intel® Core™ i3, Intel® Serie N (Codename: Alder Lake N). (FINLAY - E08)x86 Computer on Module SMARC® Processore Intel -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedKit di sviluppo e accessori Accessori Dissipatori Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
![DELTA [Discontinued]](https://edge.seco.com/media/catalog/product/cache/a5b745a475b3b98286ea46a3a3ad8c65/_/q/_q_7_q7-922_1_3.jpg)
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SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® Processore AMD -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Processore Intel -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)x86 COM Express® Processore Intel