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  1. Mass Storage
    onboard eMMC
  2. Operating Temperature
    0°C ÷ +60°C
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Arm System ready NXP 1 elemento
  3. Intel 16 elementi
  4. MediaTek 1 elemento
  5. NVIDIA 1 elemento
  6. NXP 15 elementi
  7. Qualcomm 1 elemento
  8. Rockchip 2 elementi
  9. Raspberry Pi 1 elemento
Cpu Power Consumption
  1. range 10-25 W 10 elementi
  2. range < 10 W 23 elementi
  3. range < 5 W 1 elemento
  4. range > 25 W 2 elementi
Cpu Type
  1. Intel® Atom™ 13 elementi
  2. Intel® Celeron® 10 elementi
  3. Intel® Core™ 5 elementi
  4. Intel® Pentium® 10 elementi
  5. MediaTek Genio 510 1 elemento
  6. NVIDIA Tegra® T30 1 elemento
  7. NXP i.MX 8M 3 elementi
  8. NXP i.MX 8M Mini 2 elementi
  9. NXP i.MX 8M Nano 1 elemento
  10. NXP i.MX 8M Plus 1 elemento
  11. NXP i.MX 8X 2 elementi
  12. NXP i.MX 933/935 1 elemento
  13. NXP i.MX6 5 elementi
  14. NXP i.MX8 2 elementi
  15. Qualcomm® QCS6490 1 elemento
  16. Rockchip RK3399 1 elemento
  17. Rockchip RK3568 1 elemento
  18. Zynq® Ultras 1 elemento
Ethernet
  1. ETHERNET≥1 32 elementi
  2. ETHERNET≥2 18 elementi
Form Factor
  1. COM Express® 5 elementi
  2. Qseven 9 elementi
  3. SMARC 11 elementi
  4. Boxed Solutions 2 elementi
  5. Modular HMIs 3 elementi
  6. Single Board Computer 9 elementi
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 elemento
  2. 40x70 mm (µQseven, 1.57"x 2.76") 2 elementi
  3. ≤ 100 x 100mm 20 elementi
  4. ≤ 80 x 80mm 15 elementi
  5. ≥ 100 x 100mm 13 elementi
Form Factor Specification
  1. 3,5" 6 elementi
  2. COM Express Compact 5 elementi
  3. embedded NUC 1 elemento
  4. Pico-ITX 2 elementi
  5. Qseven 70x70 mm 6 elementi
  6. µQseven 70x40 3 elementi
InstallationDepth
  1. 30-35 2 elementi
  2. memory ≤4 1 elemento
  3. memory ≤1 1 elemento
  4. memory ≤2 1 elemento
  5. soldered down 1 elemento
Memory
  1. memory ≤1 34 elementi
  2. memory ≤16 8 elementi
  3. memory ≤2 32 elementi
  4. memory ≤4 28 elementi
  5. memory ≤8 18 elementi
  6. memory ≥32 2 elementi
  7. soldered down 29 elementi
  8. SO_DIMM 5 elementi
Mounting Option
  1. VESA Mount 1 elemento
  2. Rear Mount 2 elementi
  3. Panel Mount 1 elemento
  4. Flush Mount 2 elementi
Mass Storage
  1. mSATA half-size slot 1 elemento
  2. onboard SSD 4 elementi
  3. standard SATA connector 8 elementi
  4. soldered down 1 elemento
  5. CFAST slot 2 elementi
  6. I2C EEPROM 1 elemento
  7. M.2 NVMe SSD slot 9 elementi
  8. M.2 SATA SSD slot 19 elementi
  9. microSD card slot 27 elementi
  10. onboard eMMC 4 elementi
  11. onboard eMMC 39 elementi
  12. onboard eMMC 27 elementi
  13. SATA channels ≥ 1 35 elementi
  14. SATA channels ≥ 1 3 elementi
  15. SATA channels ≥ 2 1 elemento
  16. SATA channels ≥ 2 5 elementi
  17. SATA channels ≥ 2 20 elementi
  18. SATA channels ≥ 3 5 elementi
  19. SATA channels ≥ 4 4 elementi
  20. SD interface 17 elementi
  21. SD interface 19 elementi
  22. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 elemento
  23. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 23 elementi
  2. -20°C ÷ +70°C 2 elementi
  3. -40°C ÷ +85°C 32 elementi
  4. 0°C ÷ +50°C 32 elementi
  5. 0°C ÷ +60°C 39 elementi
  6. 20°C ÷ +70°C 23 elementi
  7. -20°C ÷ +70°C 3 elementi
Pci Express
  1. PCI-e lanes ≥ 1 23 elementi
  2. PCI-e lanes ≥ 2 14 elementi
  3. PCI-e lanes ≥ 3 11 elementi
  4. PCI-e lanes ≥ 4 13 elementi
  5. PCI-e lanes ≥ 5 4 elementi
ScreenDimension
  1. 2 elementi
  2. TTL Uarts ≥1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 23 elementi
  2. TTL Uarts ≥2 22 elementi
  3. TTL Uarts ≥3 10 elementi
USB
  1. USB 2.0 ≥ 1 32 elementi
  2. USB 2.0 ≥ 2 29 elementi
  3. USB 2.0 ≥ 3 22 elementi
  4. USB 2.0 ≥ 4 20 elementi
  5. USB 2.0 ≥ 5 14 elementi
  6. USB 2.0 ≥ 6 12 elementi
  7. USB 3.0 ≥ 1 19 elementi
  8. USB 3.0 ≥ 2 14 elementi
  9. USB 3.0 ≥ 3 5 elementi
  10. USB 3.0 ≥ 4 1 elemento
  11. USB 3.1 ≥ 1 6 elementi
  12. USB 3.1 ≥ 2 4 elementi
  13. USB 3.2 ≥ 1 1 elemento
  14. USB 3.2 ≥ 2 4 elementi
  15. USB OTG 14 elementi
Video Interfaces
  1. DDI 5 elementi
  2. DP 12 elementi
  3. DP++ 11 elementi
  4. DUAL CHANNEL LVDS 25 elementi
  5. eDP 23 elementi
  6. HDMI 21 elementi
  7. MIPI-CSI camera conn 6 elementi
  8. MIPI-DSI 4 elementi
  9. SINGLE CHANNEL LVDS 25 elementi
  10. VGA 1 elemento
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 elementi
  2. M.2 SOCKET 2 KEY 6 elementi
  3. M.2 Socket 2 key B 3 elementi
  4. ONBOARD WI-FI/BLE 12 elementi
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution