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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm® IQ8 Applications Processors

SOM-SMARC-ZU

SOM-SMARC-ZU

SMARC® Rel. 2.0 Modul mit Zynq® Ultrascale+™ MPSoC. (RUSSELL - B71)

SOM-SMARC-TWL

SOM-SMARC-TWL

SMARC® Rel. 2.1 compliant module mit Intel® Intel® Core™ i3 Prozessor, Intel® Prozessoren N Series (Codename: Twin Lake). (E08)

SOM-SMARC-QCS6490

SOM-SMARC-QCS6490

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS6490 Prozessor

SOM-SMARC-QCS5430

SOM-SMARC-QCS5430

SMARC® 2.1.1 module powered by Qualcomm® Dragonwing™ QCS5430 Prozessor

SMARC®

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    NXP i.MX 8M
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Cpu Type
  1. Intel® Atom™ 4 items
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 2 items
  4. Intel® Pentium® 2 items
  5. MediaTek Genio 510 1 item
  6. MediaTek Genio 700 1 item
  7. NXP i.MX 8M 1 item
  8. NXP i.MX 8M Plus 1 item
  9. NXP i.MX 8X 1 item
  10. NXP i.MX 933/935 1 item
  11. NXP i.MX 95 1 item
  12. Qualcomm® QCS5430 1 item
  13. Qualcomm® QCS6490 1 item
  14. Zynq® Ultras 1 item
  15. Qualcomm® Dragonwing IQ-8 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. ≤ 80 x 80mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 1 item
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 3.0 ≥ 1 1 item
  4. USB 3.0 ≥ 2 1 item
  5. USB OTG 1 item
Video Interfaces
  1. DUAL CHANNEL LVDS 1 item
  2. HDMI 1 item
  3. MIPI-CSI camera conn 1 item
  4. MIPI-DSI 1 item
  5. SINGLE CHANNEL LVDS 1 item