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SOM-COMe-CT6-P100

COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

SOM-COMe-CT6-WHL-U

SOM-COMe-CT6-WHL-U

COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) mit Intel® Core™ und Celeron™ U-Serie (Codename: Whiskey Lake-U) Prozessoren der 8. (LARISSA - C55)

SOM-COMe-CT6-V2000

SOM-COMe-CT6-V2000

COM Express® 3.0 Typ 6 Kompaktmodul mit AMD Ryzen™ Embedded V2000 SoCs. (OPHELIA - D21)

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    -20°C ÷ +70°C
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Cpu Type
  1. Intel® Atom™ 2 items
  2. Intel® Core™ 3 items
Memory
  1. memory ≤1 3 items
  2. memory ≤16 3 items
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. memory ≤8 3 items
  6. SO_DIMM 3 items
Mass Storage
  1. onboard eMMC 3 items
  2. SATA channels ≥ 1 3 items
  3. SATA channels ≥ 2 3 items
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 14 items
  4. 0°C ÷ +50°C 13 items
  5. 0°C ÷ +60°C 20 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 3 items
  4. PCI-e lanes ≥ 4 3 items
  5. PCI-e lanes ≥ 5 3 items
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 3 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 3 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 3 items
  9. USB 3.0 ≥ 3 3 items
  10. USB 3.1 ≥ 1 3 items
  11. USB 3.1 ≥ 2 3 items
Video Interfaces
  1. DDI 3 items
  2. DP 3 items
  3. DUAL CHANNEL LVDS 3 items
  4. eDP 3 items
  5. HDMI 3 items
  6. SINGLE CHANNEL LVDS 3 items