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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Lüfterloser Embedded-Computer mit den Intel® Core™- und Intel® Celeron® SoCs der 11. Generation (Codename: Tiger Lake UP3) und dem Axelera KI Chip: Betrieben mit einem einzigen Metis AIPU mit bis zu 120 TOPS

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Cpu Maker
  1. AMD 4 items
  2. Intel 28 items
Cpu Power Consumption
  1. range 10-25 W 15 items
  2. range < 10 W 12 items
  3. range > 25 W 6 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series 1 item
  5. AMD® Ryzen™ embedded 1 item
  6. Intel® Atom™ 15 items
  7. Intel® Celeron® 16 items
  8. Intel® Core™ 12 items
  9. Intel® Pentium® 14 items
  10. Intel® Xeon® 1 item
Ethernet
  1. ETHERNET≥1 30 items
  2. ETHERNET≥2 16 items
Form Factor
  1. COM Express® 13 items
  2. COM-HPC® 1 item
  3. Qseven 2 items
  4. Single Board Compute 1 item
  5. SMARC 3 items
  6. Boxed Solutions 7 items
  7. Single Board Computer 1 item
  8. Single Board Computer 3 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 15 items
  2. ≤ 80 x 80mm 4 items
  3. ≥ 100 x 100mm 9 items
  4. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 4 items
  2. COM Express Compact 9 items
  3. COM-HPC Client 1 item
  4. embedded NUC 1 item
  5. Other SBCs 2 items
  6. Pico-ITX 2 items
  7. Qseven 70x70 mm 2 items
  8. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 28 items
  2. memory ≤16 24 items
  3. memory ≤2 29 items
  4. memory ≤4 29 items
  5. memory ≤8 32 items
  6. memory ≥32 17 items
  7. soldered down 17 items
  8. SO_DIMM 22 items
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 5 items
  3. CFAST slot 2 items
  4. M.2 NVMe SSD slot 2 items
  5. M.2 SATA SSD slot 10 items
  6. microSD card slot 7 items
  7. onboard eMMC 2 items
  8. onboard eMMC 15 items
  9. onboard eMMC 2 items
  10. SATA channels ≥ 1 25 items
  11. SATA channels ≥ 2 18 items
  12. SATA channels ≥ 3 5 items
  13. SATA channels ≥ 4 3 items
  14. SD interface 4 items
Operating Temperature
  1. -20°C ÷ +60°C 15 items
  2. -20°C ÷ +70°C 4 items
  3. -40°C ÷ +85°C 18 items
  4. 0°C ÷ +50°C 25 items
  5. 0°C ÷ +60°C 27 items
  6. 20°C ÷ +70°C 15 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 20 items
  2. PCI-e lanes ≥ 2 20 items
  3. PCI-e lanes ≥ 3 19 items
  4. PCI-e lanes ≥ 4 19 items
  5. PCI-e lanes ≥ 5 13 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
ScreenDimension
  1. RS232 1 item
Ttl Uarts
  1. TTL Uarts ≥1 17 items
  2. TTL Uarts ≥2 19 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 22 items
  2. USB 2.0 ≥ 2 22 items
  3. USB 2.0 ≥ 3 19 items
  4. USB 2.0 ≥ 4 19 items
  5. USB 2.0 ≥ 5 18 items
  6. USB 2.0 ≥ 6 17 items
  7. USB 3.0 ≥ 1 17 items
  8. USB 3.0 ≥ 2 16 items
  9. USB 3.0 ≥ 3 13 items
  10. USB 3.0 ≥ 4 6 items
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 6 items
  14. USB 3.2 ≥ 2 8 items
  15. USB CLIENT 1 item
  16. USB OTG 1 item
Video Interfaces
  1. DDI 11 items
  2. DP 17 items
  3. DP++ 16 items
  4. DUAL CHANNEL LVDS 16 items
  5. eDP 20 items
  6. HDMI 21 items
  7. MIPI-CSI camera conn 3 items
  8. MIPI-DSI 1 item
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 15 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 9 items
  2. M.2 SOCKET 2 KEY 4 items
  3. M.2 Socket 2 key B 6 items
  4. ONBOARD WI-FI/BLE 1 item