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SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors

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SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor

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Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

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SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors

Titan 225 RK3399

Titan 225 RK3399

Boxed solution basierend auf dem Rockchip RK3399 Anwendungsprozessor. (PICTOR - SYS-C31-IPC)

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Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. MediaTek Genio 510 1 item
  3. MediaTek Genio 700 1 item
  4. NXP i.MX 8M 5 items
  5. NXP i.MX 8M Mini 6 items
  6. NXP i.MX 8M Nano 3 items
  7. NXP i.MX 8M Plus 2 items
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  10. NXP i.MX 933/935 1 item
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  12. NXP i.MX6 10 items
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  14. Qualcomm® QCS5430 1 item
  15. Qualcomm® QCS6490 1 item
  16. Rockchip RK3399 2 items
  17. Rockchip RK3568 1 item
  18. Zynq® Ultras 1 item
  19. Qualcomm Dragonwing IQ-X 1 item
  20. MediaTek Genio360 1 item
  21. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 1 item
  4. 20°C ÷ +70°C 1 item
  5. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 3.1 ≥ 1 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. MIPI-CSI camera conn 1 item
  5. MIPI-DSI 1 item