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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Boxed solution basierend auf dem Rockchip RK3399 Anwendungsprozessor. (PICTOR - SYS-C31-IPC)

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Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 12 items
  3. range < 5 W 5 items
  4. range > 25 W 1 item
Cpu Type
  1. AMD® Ryzen™ embedded 1 item
  2. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
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  2. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. COM Express Compact 1 item
Memory
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  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. memory ≥32 1 item
  6. soldered down 1 item
  7. SO_DIMM 1 item
Mass Storage
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  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 1 item
  4. 0°C ÷ +60°C 2 items
  5. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
  5. PCI-e lanes ≥ 5 1 item
Ttl Uarts
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  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
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  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 6 1 item
  5. USB 3.0 ≥ 1 1 item
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  7. USB 3.0 ≥ 4 1 item
  8. USB OTG 1 item
Video Interfaces
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  6. SINGLE CHANNEL LVDS 2 items