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HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedEntwicklungskits & Zubehör Zubehör Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) mit AMD Ryzen™ Embedded V1000 Prozessoren. (CHARON - B75)x86 COM Express® AMD Prozessor -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module mit Intel® Intel® Core™ i3 Prozessor, Intel® Prozessoren N Series (Codename: Twin Lake). (E90)x86 COM Express® Intel Prozessor -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) mit 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Prozessoren. (CALYPSO - D40)x86 COM Express® Intel Prozessor -
SOM-COMe-CT6-R1000COM Express® 3.0 Typ 6 Kompaktmodul mit AMD Ryzen™ Embedded V1000 SoCs. (METIS - C89)x86 COM Express® AMD Prozessor
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