SOM-COMe-CT6-R1000
Höhepunkte
GraphicsAMD Ryzen™ Embedded R1000 Prozessor
MemoryZwei DDR4 SO-DIMM Slots unterstützt DDR4-2400 Speicher, bis zu 32GB
Connectivity4x USB 3.0; 8x USB 2.0; Up to 5x PCI-e x1; PEG x4 Gen3
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
|
|
COM Express® 3.0 Typ 6 Kompaktmodul mit AMD Ryzen™ Embedded V1000 SoCs |
|---|---|
|
|
AMD Ryzen™ Embedded R1606G mit GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W |
|
|
2 |
|
|
Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB |
|
|
AMD Radeon™ Vega 3 GPU mit 3 Recheneinheiten |
|
|
Bis zu 3 x digitale Display-Schnittstellen (DDIs), die DP 1.3, DVI und HDMI 1.4/2.0I unterstützen |
|
|
DDIs, eDP: bis zu 4K |
|
|
2 x S-ATA Gen3 Channels |
|
|
Gigabit Ethernet interface |
|
|
bis zu 4 x USB 3.0 Host Anschluss |
|
|
2 x PCI-e x1 Gen3-Leitbahnen |
|
|
HD Audio Interface |
|
|
2 x UARTs |
|
|
SPI, I2C, SM Bus, LPC bus, FAN management |
|
|
+12VDC ± 10% and +5VSB (optional) |
|
|
Windows 10 64-bit |
|
|
0°C ÷ +60 °C (kommerzielle Version)
*Gemessen an einem beliebigen Punkt des SECO-Standard-Heastpreaders für dieses Produkt, zu jeder Zeit (einschließlich Inbetriebnahme). Die tatsächliche Temperatur hängt stark von der Anwendung, dem Gehäuse und/oder der Umgebung ab. Der Kunde muss anwendungsspezifische Kühllösungen für das endgültige System in Betracht ziehen, um die Temperatur des Heatspreaders in dem angegebenen Bereich zu halten. |
|
|
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
Teilenummer
COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @2.6GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. Temp
COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 -Comm. Temp
COMe-C89-CT6 w/AMD Ryzen Embedded R1305G @ 1.5GHz 8W, GbE I211, 2x DDI & LVDS, TPM1.2, 2xUSB3.0, 3x PCIe Gen3 - Comm. Temp
COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @ 2.6GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp
COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp