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SOM-COMe-CT6-V1000
COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors.
(CHARON - B75)
CPU
AMD Ryzen™ Embedded V1000 processors
Grafiken
AMD Radeon™ Vega GPU with up to 11 Compute Units DirectX® 12 supported
Konnektivität
4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen3
Speicher
Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory
Produktbeschreibung
Beschreibung
|
SOM-COMe-CT6-V1000 is a COM Express® Compact Type 6 Computer on Module (CoM) with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming. |
|---|---|
CPU
|
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W |
|
Max. Kerne
|
4 |
|
Speicher
|
Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC and non- ECC Memory modules (DDR4-2400 with V1605B, V1202B and V1404I) Up to 16GB @ 3200Mhz, up to 32GB @ 2400MHz supported |
|
Grafiken
|
AMD Radeon™ Vega GPU with up to 11 Compute Units |
Videoschnittstellen
|
3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0 |
Videoauflösung
|
DDIs, eDP: up to 4K |
Massenspeicher
|
2 x S-ATA Gen3 Channels |
Networking
|
Gigabit Ethernet interface |
USB
|
4 x USB 3.0 Host ports |
|
Pci
|
Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports |
Audio
|
HD Audio Interface |
Serielle Schnittstellen
|
2 x UARTs |
Andere Schnittstellen
|
SPI, I2C bus, SM Bus, LPC bus, FAN management Optional TPM 1.2 module on-board |
Stromversorgung
|
+12VDC ± 10% and + 5VSB (optional) |
Betriebssystem
|
Microsoft® Windows 10 |
Betriebstemperatur
|
0°C ÷ +60 °C (Commercial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Größe
|
95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
| MB75-4001-2111-C1-V | Beschreibung Teilenummer COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp | |
| MB75-6001-2111-C1-V | Beschreibung Teilenummer COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp | |
| MB75-9001-1211-I1-V | Beschreibung Teilenummer COMe-B75-CT6 w/AMD Ryzen Embedded V1404I @ 2GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Ind. Temp |
Accessories
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