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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Intel 处理器

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  1. Operating Temperature
    0°C ÷ +60°C
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Cpu Power Consumption
  1. range 10-25 W 11 items
  2. range < 10 W 11 items
  3. range > 25 W 3 items
Cpu Type
  1. Intel® Atom™ 16 items
  2. Intel® Celeron® 16 items
  3. Intel® Core™ 20 items
  4. Intel® Pentium® 13 items
  5. Intel® Xeon® 2 items
Ethernet
  1. ETHERNET≥1 29 items
  2. ETHERNET≥2 17 items
Form Factor
  1. COM Express® 12 items
  2. COM-HPC® 4 items
  3. Qseven 2 items
  4. Single Board Compute 1 item
  5. SMARC 4 items
  6. Boxed Solutions 5 items
  7. Modular HMIs 2 items
  8. Single Board Computer 1 item
  9. Single Board Computer 5 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 12 items
  3. ≤ 80 x 80mm 5 items
  4. ≥ 100 x 100mm 7 items
  5. COM Express® 2 items
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Basic 6 items
  3. COM Express Compact 6 items
  4. COM-HPC Client 3 items
  5. embedded NUC 1 item
  6. Other SBCs 2 items
  7. Pico-ITX 2 items
  8. Qseven 70x70 mm 2 items
Memory
  1. memory ≤1 22 items
  2. memory ≤16 18 items
  3. memory ≤2 23 items
  4. memory ≤4 22 items
  5. memory ≤8 24 items
  6. memory ≥32 14 items
  7. soldered down 15 items
  8. SO_DIMM 16 items
Mounting Option
  1. VESA Mount 1 item
  2. Rear Mount 1 item
  3. Panel Mount 1 item
  4. Flush Mount 1 item
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 4 items
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 5 items
  5. M.2 SATA SSD slot 14 items
  6. microSD card slot 5 items
  7. onboard eMMC 2 items
  8. onboard eMMC 15 items
  9. onboard eMMC 3 items
  10. SATA channels ≥ 1 22 items
  11. SATA channels ≥ 2 1 item
  12. SATA channels ≥ 2 2 items
  13. SATA channels ≥ 2 16 items
  14. SATA channels ≥ 3 5 items
  15. SATA channels ≥ 4 4 items
  16. SD interface 4 items
  17. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 13 items
  2. -20°C ÷ +70°C 4 items
  3. -40°C ÷ +85°C 20 items
  4. 0°C ÷ +50°C 23 items
  5. 0°C ÷ +60°C 36 items
  6. 20°C ÷ +70°C 13 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 18 items
  2. PCI-e lanes ≥ 2 18 items
  3. PCI-e lanes ≥ 3 15 items
  4. PCI-e lanes ≥ 4 18 items
  5. PCI-e lanes ≥ 5 13 items
ScreenDimension
  1. 14-19 1 item
Ttl Uarts
  1. TTL Uarts ≥1 14 items
  2. TTL Uarts ≥2 19 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 20 items
  2. USB 2.0 ≥ 2 21 items
  3. USB 2.0 ≥ 3 16 items
  4. USB 2.0 ≥ 4 16 items
  5. USB 2.0 ≥ 5 15 items
  6. USB 2.0 ≥ 6 17 items
  7. USB 3.0 ≥ 1 13 items
  8. USB 3.0 ≥ 2 12 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 3 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 7 items
  14. USB 3.2 ≥ 2 10 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 1 item
  19. USB CLIENT 3 items
  20. USB OTG 4 items
Video Interfaces
  1. DDI 12 items
  2. DP 13 items
  3. DP++ 18 items
  4. DUAL CHANNEL LVDS 16 items
  5. eDP 23 items
  6. HDMI 21 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 14 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 9 items
  2. M.2 SOCKET 2 KEY 3 items
  3. M.2 Socket 2 key B 6 items