SBC-3.5-TGL-UP3

SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)

Available in Industrial Temperature Range

数据表

Wiki

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中央处理器

11th Gen Intel® Core™ processors and Intel® Celeron® SoCs

图形

Intel® Iris® Xe Architecture with up to 96 EUs, up to 4 independent displays

连接

2x SuperSpeed USB 10Gbps; 2x SuperSpeed USB 20Gbps; 2x USB 2.0; 4x PCIe Gen3; 2x 2.5GbE

记忆

Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC

产品详情

技术信息

说明	3.5” SBC with the 11th Gen Intel® Core™ and Intel® Celeron® (formerly Tiger Lake UP3) Processors
中央处理器说明	Intel® Core™ i7-1185G7E, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, 28W TDP (12W cTDP) Intel® Core™ i5-1145G7E, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, 28W TDP (12W cTDP) Intel® Core™ i3-1115G4E, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, 28W TDP (12W cTDP) Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB Cache, 15W TDP Intel® Core™ i7-1185GRE, Quad Core @2.8GHz (4.4GHz Turbo) with HT, 12MB Cache, with IBECC, 28W TDP (12W cTDP) – Industrial Intel® Core™ i5-1145GRE, Quad Core @2.6GHz (4.1GHz Turbo) with HT, 8MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial Intel® Core™ i3-1115GRE, Dual Core @3.0GHz (3.9GHz Turbo) with HT, 6MB Cache, with IBECC, 28W TDP (12W cTDP) - Industrial
最大核数	4
内存说明	2x DDR4-3200 SODIMM slots Up to 64GB with IBECC supported only with Intel® Core™ Industrial SoCs
图形说明	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities Support for up to 48 simultaneous 1080p streams ingestion Support for up to four independent displays at up to 4K60 HDR resolution or one display at 8K resolution
视频界面说明	2x Multimode DisplayPort 1.4, on Dual DP++ connector 2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode) 1x eDP 1.3 or Single/Dual-Channel 18-/24-bit LVDS interface
视频分辨率说明	DP, eDP Up to 5120x3200 @60Hz 24bpp / 7680x4320 @60Hz 30bpp with DSC HDMI 1.4 Up to 4Kx2K 24-30Hz 24bpp
大容量存储器说明	M.2 SATA SSD slot (socket 2 Key B type 2242/3042) M.2 NVMe slot (socket 3 Key M type 2280) PCIe Gen4 supported SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
网络说明	2x NBase-T Ethernet interfaces, supporting 2.5Gb Ethernet connection, managed by as many Intel® i225 2.5GbE controllers M.2 WWAN slot (socket 2 Key B type 2242/3042) coupled to on-board Micro-SIM slot. M.2 WiFi/BT slot (socket 1 Key E type 2230) SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive
USB说明	2x SuperSpeed USB 10Gbps ports on Dual type-A socket 2x SuperSpeed USB 20Gbps ports on USB type-C slots 2x USB 2.0 on pin header
音频说明	HD audio codec / Cirrus Logic CS4207 Mic In, Line Out and S/PDIF Out, on pin header
串行端口	2x RS-232/RS-422/RS-485 UARTS software configurable, on pin header
其他接口	2x Expansion M.2 slot (socket 3 Key M type 2280) with 4x PCIe Gen3 lanes 8x GPIOs, 2x I2C, SPI connectors FAN connector RST_BTN#, PWR_BTN# and activity LED signals on pin header Optional TPM 2.0 on-board
电源	+12VDC .. +24VDC range Cabled coin cell battery for RTC
操作系统	Microsoft® Windows 10 IoT Enterprise LTSC 2021 Linux (Kernel ≥ 5.4 version)
操作温度说明	0°C ÷ +60°C (Commercial version) -40°C÷ +85°C (Industrial version) *Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will depend on the application, enclosure, and/or environment. Each customer must consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
尺寸	146 x 102 mm (3.5” form factor)

软件

链接	SECO Technical Resources

文件

Data Sheet	[Datasheet] SBC-3.5-TGL-UP3 Rel 1.0
Manual	[Manual] SBC-3.5-TGL-UP3 Rev.1.0
Image	[Picture] SBC-3.5-TGL-UP3_front [Picture] SBC-3.5-TGL-UP3_back [Picture] SBC-3.5-TGL-UP3_ISO scont

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