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Titan 300 TGL-UP3 AI不带风扇的嵌入式计算机,配备第11代英特尔® Core™和英特尔® Celeron® SoCs(代号:Tiger Lake UP3)以及Axelera AI芯片:由单个Metis AIPU提供动力,最高可达120 TOPSx86 Intel 处理器 无风扇嵌入式计算机 人工智能优化硬件 -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)Intel 处理器 无风扇嵌入式计算机 -
SOM-SMARC-TWLSMARC® Rel. 2.1 compliant module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E08)模块 SMARC® Intel 处理器 -
SOM-COM-HPC-A-MTLCOM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)x86 模块 COM-HPC® Intel 处理器 -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 模块 COM-HPC® Intel 处理器 人工智能优化硬件 -
SBC-3.5-TGL-UP3SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)Intel 处理器 SBC 3.5-inch SBC



