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Titan 300 TGL-UP3 AI不带风扇的嵌入式计算机,配备第11代英特尔® Core™和英特尔® Celeron® SoCs(代号:Tiger Lake UP3)以及Axelera AI芯片:由单个Metis AIPU提供动力,最高可达120 TOPSx86 Intel 处理器 无风扇嵌入式计算机 人工智能优化硬件 -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Intel 处理器 -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)x86 COM Express® Intel 处理器 -
SOM-COMe-CT6-ASL采用Intel Atom® x7000E系列处理器(代号:Amston Lake和Alder Lake N)的COM Express® 3.1 Type 6紧凑型模块x86 COM Express® Intel 处理器 -
SOM-COMe-CT6-WHL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 8th Gen Intel® Core™ and Celeron™ U-series (Codename: Whiskey Lake-U) Processors. (LARISSA - C55)x86 COM Express® Intel 处理器 -
SOM-COMe-CT6-ADL-NCOM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Alder Lake N). (E90)x86 COM Express® Intel 处理器



