SOM-COMe-CT6-ADL-N

COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Alder Lake N). (E90)

Available in Industrial Temperature Range

数据表

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中央处理器

Intel® Atom® Processors x7000E Series, Intel® Processor N series and Intel® Core™ i3 N305 Processor

图形

Integrated Intel® Gen12 UHD graphics controller with up to 32 EU

连接

1x NBase-T 2.5GbE; up to 2x USB 10Gbps + 3x USB 5Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen3

记忆

One SO-DIMM slot supporting DDR5-4800 IBECC memory, up to 16GB

产品详情

技术信息

说明	COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Alder Lake N). (E90)
中央处理器说明	Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded E Series: • Intel Atom® x7425E Quad Core @1.5GHz (3.4GHZ turbo) 12W TDP w/ TSN and TCC, commercial • Inte Atom® x7213E Dual Core @1.7GHz (3.2GHZ turbo) 10W TDP w/ TSN and TCC, commercial • Intel Atom® x7211E Dual Core @1GHz (3.2GHZ turbo) 6W TDP w/ TSN TCC, commercial Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) PC Client Processors: • Intel® Core™ i3-N305 Eight Core @1GHz / 1.8GHz (3.8GHZ turbo) 9W/15W TDP w/o TSN and w/o TCC, commercial • Intel® Processor N200 Quad Core @1GHz (3.7GHZ turbo) 6W TDP w/o TSN and w/o TCC - commercial • Intel® Processor N97 Quad Core @2GHz (3.6GHZ turbo) 12W TDP w/o TSN and w/o TCC - commercial • Intel® Processor N50 Dual Core @1GHz (3.4GHZ turbo) 6W TDP w/o TSN and w/o TCC - commercial () TCC: Time Coordinated Computing (*) TSN: Time Sensitive Networking
内存说明	One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB (*) IBECC: In-Band Error-Correcting Code memory
图形说明	Integrated Intel® Gen12 UHD graphics controller with up to 32 EU Support up to 3 independent displays
视频界面说明	2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C 1x DDI Interface supporting DP / HDMI® 1x eDP or Single/Dual-Channel 18-/24-bit LVDS interface (factory alternatives)
视频分辨率说明	HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b DP 1.4, eDP 1.4: 4096x2304@60 Hz LVDS up to 1920x1200 @ 60Hz
大容量存储器说明	Up to 2x S-ATA Gen3 channels Optional eMMC 5.1 drive soldered on-board
网络说明	1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN
USB说明	Up to 2x USB 10Gbps Optional 3x USB 5Gbps 8x Hi-Speed USB ports
Pci Description	Up to 6x PCI-e Gen3 lanes
音频说明	HD Audio interface SoundWire Interface
串行端口	2x UARTs
其他接口	SPI, 2x I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 1.2/2.0 on-board LID#/SLEEP#/PWRBTN#, watchdog 4x GPI, 4x GPO Optional 2x CSI camera interfaces
电源	+12VDC ± 10%, +5VSB (optional), +3VRTC (optional)
操作系统	Microsoft® Windows 10 IoT Enterprise 2019 LTSC Microsoft® Windows 10 IoT Enterprise 2021 LTSC Clea OS (Yocto)
操作温度说明	0°C ÷ +60°C (Commercial version) -40°C ÷ +85°C (Industrial version) * Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
尺寸	95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout)