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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
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  1. Form Factor Dimensions
    ≤ 100 x 100mm
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Cpu Maker
  1. AMD 6 items
  2. Intel 15 items
  3. MediaTek 2 items
  4. NXP 8 items
  5. Qualcomm 3 items
Cpu Power Consumption
  1. range 10-25 W 13 items
  2. range < 10 W 13 items
  3. range > 25 W 4 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 3 items
  3. Intel® Atom™ 12 items
  4. Intel® Celeron® 9 items
  5. Intel® Core™ 6 items
  6. Intel® Pentium® 4 items
  7. MediaTek Genio 510 1 item
  8. MediaTek Genio 700 1 item
  9. NXP i.MX 8M 2 items
  10. NXP i.MX 8M Mini 1 item
  11. NXP i.MX 8M Nano 1 item
  12. NXP i.MX 8M Plus 1 item
  13. NXP i.MX 8X 1 item
  14. NXP i.MX 95 1 item
  15. NXP i.MX6 1 item
  16. NXP i.MX8 1 item
  17. Qualcomm® QCS5430 1 item
  18. Qualcomm® QCS6490 1 item
  19. Zynq® Ultras 1 item
  20. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 29 items
  2. ETHERNET≥2 11 items
Form Factor
  1. COM Express® 12 items
  2. Qseven 8 items
  3. SMARC 14 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 5 items
  2. 40x70 mm (µQseven, 1.57"x 2.76") 3 items
  3. 48,5 x 32,5 mm 2 items
  4. 67,6 x 36,7 mm 4 items
  5. ≤ 100 x 100mm 34 items
  6. ≤ 80 x 80mm 17 items
  7. ≥ 100 x 100mm 4 items
  8. COM Express® 3 items
Form Factor Specification
  1. COM Express Compact 12 items
  2. Qseven 70x70 mm 6 items
  3. µQseven 70x40 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 28 items
  2. memory ≤16 12 items
  3. memory ≤2 29 items
  4. memory ≤4 29 items
  5. memory ≤8 21 items
  6. memory ≥32 7 items
  7. soldered down 21 items
  8. SO_DIMM 10 items
  9. memory ≤32 1 item
Mass Storage
  1. onboard SSD 2 items
  2. microSD card slot 3 items
  3. onboard eMMC 23 items
  4. onboard eMMC 3 items
  5. SATA channels ≥ 1 21 items
  6. SATA channels ≥ 2 13 items
  7. SATA channels ≥ 2 2 items
  8. SATA channels ≥ 3 1 item
  9. SD interface 14 items
  10. SD interface 3 items
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 24 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 25 items
  4. 0°C ÷ +50°C 25 items
  5. 0°C ÷ +60°C 31 items
  6. 20°C ÷ +70°C 22 items
  7. -20°C ÷ +70°C 7 items
Pci Express
  1. PCI-e lanes ≥ 1 28 items
  2. PCI-e lanes ≥ 2 23 items
  3. PCI-e lanes ≥ 3 18 items
  4. PCI-e lanes ≥ 4 17 items
  5. PCI-e lanes ≥ 5 11 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 28 items
  2. TTL Uarts ≥2 25 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 29 items
  2. USB 2.0 ≥ 2 29 items
  3. USB 2.0 ≥ 3 27 items
  4. USB 2.0 ≥ 4 25 items
  5. USB 2.0 ≥ 5 21 items
  6. USB 2.0 ≥ 6 19 items
  7. USB 3.0 ≥ 1 17 items
  8. USB 3.0 ≥ 2 13 items
  9. USB 3.0 ≥ 3 6 items
  10. USB 3.0 ≥ 4 4 items
  11. USB 3.1 ≥ 1 9 items
  12. USB 3.1 ≥ 2 5 items
  13. USB 3.2 ≥ 1 2 items
  14. USB 3.2 ≥ 2 3 items
  15. USB OTG 8 items
Video Interfaces
  1. DDI 11 items
  2. DP 19 items
  3. DP++ 7 items
  4. DUAL CHANNEL LVDS 28 items
  5. eDP 24 items
  6. HDMI 22 items
  7. MIPI-CSI camera conn 8 items
  8. MIPI-DSI 6 items
  9. SINGLE CHANNEL LVDS 24 items
  10. VGA 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. ONBOARD WI-FI/BLE 6 items
  3. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®