SOM-SMARC-ASL

符合SMARC® Rel 2.1标准的模块，采用用于Edge应用的Intel Atom® x7000RE系列处理器

Available in Industrial Temperature Range

数据表

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中央处理器

Intel Atom® x7000RE系列处理器（代号：Amston Lake），针对工业物联网应用

图形

集成的Intel® UHD图形，由Intel® Xe架构驱动，最多支持32个执行单元，支持3个独立显示器

连接

2 x NBase-T（支持2.5GbE）；6x 高速USB；2x USB 10Gbps；4x PCI-e Gen3通道，带可选的SERDES

记忆

最多16GB的LPDDR5-4800焊接内存，带IBECC（带内错误校正码）

产品详情

技术信息

说明	符合SMARC® Rel 2.1标准的模块，采用用于Edge应用的Intel Atom® x7000RE系列处理器
中央处理器说明	Intel Atom® Processors x7000RE Series (Codename: Amston Lake) Intel Atom® processor x7211RE, 2 cores @1 GHz (3.2 GHz turbo), 6W TDP, with TSN and TCC* Intel Atom® processor x7213RE, 2 cores @2 GHz (3.4 GHz turbo), 9W TDP, with TSN and TCC* Intel Atom® processor x7433RE, 4 cores @1.5 GHz (3.4 GHz turbo), 9W TDP, with TSN and TCC* Intel Atom® processor x7835RE, 8 cores @1.3 GHz (3.6 GHz turbo), 12W TDP, with TSN and TCC* * Time Sensitive Network and Time Coordinate Computing
最大核数	8
内存说明	Up to 16GB LPDDR5-4800 soldered down memory with IBECC (In-Band Error Correction Code)
图形说明	Integrated Intel® UHD Graphics driven by Intel® Xe architecture: Intel Atom® processor x7211RE with 16 Execution Units Intel Atom® processor x7213RE with 16 Execution Units Intel Atom® processor x7433RE with 32 Execution Units Intel Atom® processor x7835RE with 32 Execution Units AVX256 & VNNI support for faster AI inference and media transcoding Support with up to 3 independent 4K60 SDR displays
视频界面说明	eDP 1.3 or dual channel 18/24bit LVDS interface (factory alternatives) 2x DP++ multimode DP 1.4 / HDMI® 2.1 interface 2x MIPI CSI-2 inputs (1 x 2-lanes and 1 x 4-lanes)
视频分辨率说明	Up to 4096x2160 @60Hz
大容量存储器说明	1x external S-ATA Gen3.2 channel Optional eMMC 5.1 drive soldered on-board
网络说明	2x NBase-T ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane)
USB说明	6x Hi-Speed USB interfaces 2x USB 10Gbps interfaces
Pci Description	4x PCIe lanes Gen3 Possible channel aggregations: 4 ports x1 lanes (4x1) 1 port x2 lanes + 2 ports x1 lane (1x2 + 2x1) or SERDES in place of fourth PCIe lane
音频说明	HD audio and Soundwire / i2S audio interfaces
串行端口	2x UARTs 2x HS-UARTs
其他接口	Up to 14x GPIOs SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals Watchdog
电源	+5VDC and +3VDC for RTC
操作系统	Microsoft® Windows 10 Linux Kernel LTS
操作温度说明	-40°C ÷ +85°C (Industrial version) * * Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
尺寸	50 x 82 mm

文件

Data Sheet	[Datasheet] SOM-SMARC-ASL Rel 1.0
Image	[Picture] SOM-SMARC-ASL_front [Picture] SOM-SMARC-ASL_back

Part Number

Prices hereunder are valid for SAMPLES (purchase limited to 3pcs).
If you would like to know prices for higher volumes, please contact us.

组合的产品项目
EE08-B232-2111-I1	部件编号说明 SMARC 2.1 w/ Amston Lake Intel® Atom x7213RE, 4GB RAM d.c., 32GB eMMC, x2Eth, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1) TPM SLB 9670 Q1.2 (CFG H0) - ind, SPI1 GP SPI	联系我们
EE08-C232-2111-I1	部件编号说明 SMARC 2.1 w/ Amston Lake Intel® Atom x7433RE, 4GB RAM d.c., 32GB eMMC, x2Eth, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q1.2 (CFG H0) - ind, SPI1 GP SPI	联系我们
EE08-D632-2122-I1	部件编号说明 SMARC 2.1 w/ Amston Lake Intel® Atom® x7835RE, 8GB RAM d.c., 64GB eMMC, x2Eth, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q2.0 (CFG H0) - Ind, eSPI	联系我们

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