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SOM-SMARC-ADL-N
亮点
GraphicsIntegrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution
MemoryQuad Channel LPDDR5 soldered down with IBECC
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
发现与该产品兼容的应用程序，可在SECO应用程序中心获得：即用型解决方案，可加快智能功能的开发和部署。
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
描述
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SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) |
|---|---|
CPU Description
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Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor and Intel® Processors N Series (Codename: Alder Lake N): · Intel® Atom® x7213E, 2 Cores @1.7 GHz (3.2 GHz Turbo), 10W TDP, with TSN and TCC* · Intel® Atom® x7425E, 4 Cores @1.5 GHz (3.4 GHz Turbo), 12W TDP, with TSN and TCC* · Intel® Atom® x7211E, 2 Cores @1.0 GHz (3.2 GHz Turbo), 6W TDP, with TSN and TCC* · Intel® Core™ i3-N305, 8 Cores @1.8 GHz (3.8 GHz Turbo), 15W TDP · Intel® Processor N200, 4 Cores @1.0 GHz (3.7 GHz Turbo), 6W TDP · Intel® Processor N97, 4 Cores @2.0 GHz (3.6 GHz Turbo), 12W TDP · Intel® Processor N50, 2 Cores @1 GHz (3.4 GHz Turbo), 6W TDP * Time Sensitive Network and Time Coordinate Computing |
Memory Description
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Up to 16GB LPDDR5-4800 soldered down memory with IBECC (in-band error correction code) |
Graphics Description
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Integrated Intel® UHD Graphics driven by Intel® Xe architecture:
AVX256 & VNNI support for faster AI inference and media transcoding Support with up to 3 independent 4K60 SDR displays |
Video Interfaces Description
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Integrated Intel® UHD Graphics driven by Intel® Xe architecture, supporting 3 independent displays each up to 4K resolution |
Video Resolution Description
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Up to 4096x2160 @60Hz |
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Mass Storage Description
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1x external S-ATA Gen3.2 channel Optional eMMC 5.1 drive soldered on-board |
Networking Description
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2x NBase-T Ethernet ports (2.5GbE supported) with Time-Sensitive Networking functionality, implemented using as many Intel® i225 Gigabit Ethernet controllers, managed by two integrated PCH PCI-e ports Optional SERDES (SGMII) interface for additional third Gigabit Ethernet (factory option, alternative to fourth PCI-e lane) |
USB Description
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6x USB 2.0 host ports 2x USB 3.2 Gen2 ports |
PCI Description
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4x PCIe Gen3 lanes Possible channel aggregations:
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Audio Description
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HD Audio and Soundwire/i2S Audio interfaces |
Serial Ports
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2x UARTs 2x HS-UARTs |
Other Interfaces
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Up to 14x GPIOs SM bus I2C bus 1x SPI interface for boot 1x General Purpose SPI or eSPI (factory alternatives) Power management signals, watchdog |
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Power Supply
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+5VDC and +3VDC for RTC |
Operating System
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Microsoft® Windows 10 Linux Kernel LTS |
Operating Temperature Description
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0°C to +60°C (Commercial version) *
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature depends on the application, enclosure, and/or environment. It is the customer’s responsibility to implement an application-specific cooling solution for the customer’s system that keeps the heat spreader temperature in the range indicated. |
Dimensions
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50 x 82 mm |
零件编号
SMARC 2.1 w/ Alder Lake N Intel® N50, LPDDR5 4800 MT/s, 2 core, RAM 4GB, eMMC 32GB, x1 Gigabit Ethernet, eDP + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q2.0, with SPI1 GP SPI
SMARC 2.1 w/ Alder Lake N Intel® N200, LPDDR5 4800 MT/s, 4 core, RAM 8GB, eMMC 64GB, x2 Gigabit Ethernet, LVDS + DP++ + DP++, w/ SERDES (PCIe: (1x2 + 1x1 or 3x1) + SERDES), TPM SLB 9670 Q2.0, with eSPI
SMARC 2.1 w/ Alder Lake N Intel® Core i3-N305, LPDDR5 4800 MT/s, 8 core, RAM 16GB, eMMC 64GB, x2 Gigabit Ethernet, LVDS + DP++ + DP++, w/o SERDES (PCIe: 4x1 or 1x2 + 2x1), TPM SLB 9670 Q2.0, with SPI1 GP SPI
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