ZH
DE 
EN - € 
ES 
FR 
IT 
JP 
USA 
产品详情
说明
|
SMARC® 2.1.1 module powered by Qualcomm® QCS6490 processor |
|---|---|
中央处理器说明
|
1x Arm® Cortex®-A78 @2.7 GHz, 3x Arm® Cortex®-A78 @2.4 GHz, and 4x Arm® Cortex®-A55 @1.8 GHz |
|
内存说明
|
Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels |
图形说明
|
Qualcomm® Adreno™ 643L |
视频界面说明
|
LVDS dual channel 18/24bit, eDP V1.4, MIPI DSI 4 lanes, Display Port through USB 3.1 Type C 2x 4-Line MIPI CSI, with ISP support |
视频分辨率说明
|
Primary display: FHD+ @120 fps |
大容量存储器说明
|
eMMC 5.1 drive soldered on-board, up to 64GB (boot device) |
网络说明
|
2x Gigabit Ethernet interfaces |
USB说明
|
1x USB 3.1, 1x USB 2.0 OTG, 1x USB 2.0 or 4x USB 2.0 (Hub option) |
|
Pci Description
|
PCIe lanes Gen3: 2 ports x1 lanes, 1 port x2 lanes (QPS615) |
音频说明
|
2x I2S |
串行端口
|
2x UART (RX/TX/RTS/CTS), 2x UART (RX/TX) |
其他接口
|
2C |
安全性
|
Optional TPM 2.0 on-board |
嵌入式控制器功能=
|
FAN |
电源
|
5V DC (+5V Standby opt) |
操作系统
|
Microsoft Windows 11 IoT Enterprise |
操作温度说明
|
0 ÷ +60°C (Commercial Range)
Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
尺寸
|
82 x 50 mm |
| EE81-3212-5537-E1 | 部件编号说明 SOM-SMARC-QCS6490 w/QCS6490, 8GB LPDDR5/UFS128G. no eMMC, SDIO, Wifi/BT AW-CM276NF. Dual-LVDS (LVDS0, LVDS1) and DP 4-lane, 2x Ethernet 1Gbit - Industrial, with QPS615 (PCIe_A/B/C/D), USB Hub – Industrial, TPM SLB 9673, CAN-Controller, CSI_2 |
超售
