我们的产品

面向最具创新性项目的一系列广泛的 SECO 产品:模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案,以及载板、入门套件和所有能有助完成您的项目的配件。

项目 11027

页面
每页
设置降序方向
  1. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    采用Intel Atom® x7000E系列处理器(代号:Amston Lake和Alder Lake N)的COM Express® 3.1 Type 6紧凑型模块
  2. SOM-COMe-BT6-MTL
    SOM-COMe-BT6-MTL
    COM Express® 3.1 Type 6 Basic Module with Intel® Core™ Ultra Processors Family (Codename: Meteor Lake -H and -U)
  3. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
  4. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  5. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  6. Krater RV1000
    Krater RV1000
    Embedded Computer for Digital Signage applications with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (KRATER - SYS-C90-DS)
  7. SBC-3.5-RV1000
    SBC-3.5-RV1000
    3.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)
  8. SOM-COM-HPC-A-TGL-UP3
    SOM-COM-HPC-A-TGL-UP3
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)
  9. SOM-COM-HPC-A-RPL
    SOM-COM-HPC-A-RPL
    COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
  10. Titan 300 TGL-UP3
    Titan 300 TGL-UP3
    Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

项目 11027

页面
每页
设置降序方向