我们的产品

面向最具创新性项目的一系列广泛的 SECO 产品:模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案,以及载板、入门套件和所有能有助完成您的项目的配件。

7 项目

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  1. SOM-COM-HPC-A-MTL
    SOM-COM-HPC-A-MTL
    COM-HPC® Size A Client Module with Intel® Core™ Ultra Processors Family (codename: Meteor Lake -H and -U)
  2. Palladio 400 RPL
    Palladio 400 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  3. Palladio 500 RPL
    Palladio 500 RPL
    Modular fanless embedded PC with 13th Gen Intel® Core™ processors
  4. SOM-COM-HPC-A-RPL
    SOM-COM-HPC-A-RPL
    COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
  5. Titan 300 TGL-UP3
    Titan 300 TGL-UP3
    Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)
  6. Titan 300 TGL-UP3 AI
    Titan 300 TGL-UP3 AI
    不带风扇的嵌入式计算机,配备第11代英特尔® Core™和英特尔® Celeron® SoCs(代号:Tiger Lake UP3)以及Axelera AI芯片:由单个Metis AIPU提供动力,最高可达120 TOPS
  7. SBC-3.5-TGL-UP3
    SBC-3.5-TGL-UP3
    SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)

7 项目

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