SOM-COMe-CT6-R1000




Product details
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Low-end AMD Ryzen® on COM Express® Type 6 Compact Computer on Module (CoM) |
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AMD Ryzen™ Embedded R1606G with GPU AMD Radeon™ Vega 3, Dual Core Four Thread @ 2.6GHz (3.5 Boost), TDP 12-25W |
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2 |
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Two DDR4 SO-DIMM Slots supporting DDR4-2400 Memory, up to 32GB |
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AMD Radeon™ Vega 3 GPU with 3 Compute Units |
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Up to 3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0I |
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DDIs, eDP: up to 4K |
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2 x S-ATA Gen3 Channels |
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Gigabit Ethernet interface |
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Up to 4 x USB 3.0 Host ports |
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2 x PCI-e x1 Gen3 lanes |
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HD Audio Interface |
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2 x UARTs |
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SPI, I2C, SM Bus, LPC bus, FAN management |
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+12VDC ± 10% and +5VSB (optional) |
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Windows 10 64-bit |
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0°C ÷ +60 °C (Commercial version)
*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
MC89-1002-2211-C0-V | Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @2.6GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 - Comm. Temp | |
MC89-2002-2211-C0-V | Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I211, 2x DDI & LVDS, TPM1.2, 4xUSB3.0, 2x PCIe Gen3 & 3x PCIe Gen2 -Comm. Temp | |
MC89-3002-2222-C0-V | Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1305G @ 1.5GHz 8W, GbE I211, 2x DDI & LVDS, TPM1.2, 2xUSB3.0, 3x PCIe Gen3 - Comm. Temp | |
MC89-1001-1212-C0-V | Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1606G @ 2.6GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp | |
MC89-2001-1212-C0-V | Part Number Description COMe-C89-CT6 w/AMD Ryzen Embedded R1505G @ 2.4GHz 15W, GbE I210, eDP, TPM SLB 9670 Q1.2, HUB - Comm. Temp |

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