SOM-COMe-CT6-R8000
COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™
Embedded 8000 Series

Cpu
APU AMD Ryzen™ 7 Pro and 5 Pro 8000 U
and HS Series

Graphics
Integrated AMD RDNA 3 graphics with
up to 6 WGPs

Memory
2x DDR5-5600 SODIMM Slots
Product details
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COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ Embedded 8000 Series |
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AMD Ryzen™ Embedded 8000 Series Processors: AMD Ryzen™ 7 Pro 8845HS. 8 Core / 16 Threads @ 3.8GHz (5.1GHZ Turbo), 6WGPs, TDP 45W (35-54W) AMD Ryzen™ 5 Pro 8645HS. 6 Core / 12 Threads @ 4.3GHz (5.0GHZ Turbo), 4WGPs, TDP 45W (35-54W) AMD Ryzen™ 7 Pro 8840U. 8 Core / 16 Threads @ 3.3GHz (5.1GHZ Turbo), 6WGPs, TDP 28W (15-30W) AMD Ryzen™ 5 Pro 8640U. 6 Core / 12 Threads @ 3.5GHz (4.9GHZ Turbo), 4WGPs, TDP 28W (15-30W) |
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2x DDR5-5600 SODIMM Slots |
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Integrated AMD RDNA 3 graphics with up to 6 WGPs (Work Group processors) |
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Up to 4 independent displays. 2x DDI interfaces upporting DP 2.0, HDMI 2.1, DP Alt mode over Type-C 1x DDI interface supporting DP 2.0 / HDMI 2.1 eDP 1.5 or LVDS Single/Dual Channel interfaces (factory alternatives). |
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HDMI: Max 8K60 DP: Max 7680x4320@60Hz eDP, USB-C DP ALt: Max 3840x2160@240Hz LVDS: Max 1920x1200 Max resolution 4 x 3840*2160@60Hz |
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2x USB 40Gbps interfaces 2x USB 10Gbps interfaces (without USB Hub) 1x USB 10Gbps + 3x USB 5Gbps interfaces (with USB Hub) 8x Hi-Speed USB |
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8x PCIe Gen 4 lanes (max 6 root ports) 1x8 or 2x4 PCI-e Graphics (PEG) Gen4 port |
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HD Audio interface, Soundwire interface |
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2x 2-wires serial ports |
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SPI, I2C, SM Bus, thermal management, FAN management LPC bus TPM 2.0 on-board (factory option) LID#/SLEEP#/PWRBTN#, watchdog 4 x GPI, 4 x GPO |
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Main Power: +12Vdc ± 10% Auxiliary: +5V_SBY, +3V_RTC |
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SECO Clea OS Microsoft® Windows 11 IoT Enterprise |
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0°C ÷ +60°C (Commercial version) |
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95 x 95 mm (Com Express® Compact Form factor, Type 6 pinout) |

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