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Fanless Embedded Computers
Off-The-Shelf Solutions
Experience in assembly services and mechanical design
Cloud-agnostic
Multi-protocol industrial Ethernet support
Ideal for Industrial IoT applications
System integration-ready solutions
Possibilities Offered by SECO
Heat dissipation solutions - both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
Manufacturing of plastic components with injection molding
Production of aluminum mechanical parts with extrusion technology
Design of mechanical parts with die-casting technology
Bending and pressing of sheet metal parts
Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays, etc.
Description
Thanks to our experience in integrating modules and boards into complex systems, SECO has created “off-the-shelf” solutions based on its own ARM and x86 SBCs, all available in our catalog. SECO Fanless Embedded Computers have been developed for applications in Industrial IoT with the goal of satisfying the need for flexibility and security.
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Modular Link MX93DIN Mount Industrial Gateway with the NXP i.MX 93 SoC -
Easy EdgeIoT Sensor to Cloud -
Titan 300 TGL-UP3Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC) -
Titan 220 RK3399IP20 Fanless embedded PC based on Rockchip RK3399 Applications Processor. (DORADO - SYS-C31-IGW) -
Titan 225 RK3399Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC) -
Titan 240 APLFanless Embedded Computer with Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (PEGASUS - SYS-C41-IPC) SYS-C41-IPC -
Titan 210 MX8MFanless Embedded Computer with NXP i.MX 8M Applications Processors. (PAVO - SYS-C20-IPC)
