Titan 300 TGL-UP3

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)

Data sheet

Wiki

Cpu

11th Gen Intel® Core™ processors and Intel® Celeron® SoCs

Graphics

Intel® Iris® Xe architecture with up to 96 EUs, up to 4 independent displays

Connectivity

2x 2.5 GbE, Optional M.2 WWAN and WLAN modules

Memory

Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory with IBECC

Product details

Technical Info

Description	Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3)
Cpu	Intel® Core™ i7-1185G7E, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, 28W TDP (12W cTDP) Intel® Core™ i5-1145G7E, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, 28W TDP (12W cTDP) Intel® Core™ i3-1115G4E, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, 28W TDP (12W cTDP) Intel® Celeron® 6305E, Dual Core @1.8GHz, 4MB cache, 15W TDP Intel® Core™ i7-1185GRE, Quad Core @ 2.8GHz (4.4GHz Turbo) with HT, 12MB cache, with IBECC, 28W TDP (12W cTDP) – Industrial Intel® Core™ i5-1145GRE, Quad Core @ 2.6GHz (4.1GHz Turbo) with HT, 8MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial Intel® Core™ i3-1115GRE, Dual Core @ 3.0GHz (3.9GHz Turbo) with HT, 6MB cache, with IBECC, 28W TDP (12W cTDP) - Industrial
Max Cores	4
Memory	2x DDR4-3200 SODIMM slots Up to 64GB with IBECC supported only with Core™ industrial SoCs
Graphics	Up to two video decode boxes (VDBoxes) for enhanced video stream capabilities Support for up to four independent displays at up to 4K60 HDR resolution or one display at 8K resolution
Video Interfaces	2x Multimode DisplayPort 1.4, on dual DP++ connector 2x Multimode Display Port 1.4 on USB Type-C connectors (alternate mode)
Video Resolution	DP: up to 5120x3200 @60Hz 24bpp / 7680x4320@60Hz 30bpp with DSC HDMI 1.4: up to 4Kx2K 24-30Hz 24bpp
Mass Storage	On-Board NMVe Drive, up to 2 modules with global capacity up to 1TB
Networking	2x 2.5 Gigabit Ethernet RJ45 connectors Optional on-board M.2 Wi-Fi (802.11 ac / a / b / g / n) + BT 5.0 module, with dipole antennas included* Optional on-board M.2 LTE modem with Mini-SIM slot, with dipole antennas included* *Certification upon request
Usb	2x Superspeed USB 10Gbps ports on Dual Type-A sockets 2x Superspeed USB 20Gbps on USB Type-C slots
Audio	Lineout + MicIn combo TRRS Audio Jack
Serial Ports	2x RS-232/RS-422/RS-485 UARTS software configurable, on DB9 connector
Other Interfaces	Optional 2x 12 poles terminal block connectors with the following I/O: 8x GPIOs 1x I2C 1x SPI 1x 5V 1x 3.3V 1x 12V 3x GND Power ON Button Optional TPM 1.2/2.0 module on-board
Power Supply	12VDC to 24VDC range, Mega-Fit 2p RA Connector Coin cell battery for RTC On-Board
Operating System	Microsoft® Windows 10 IoT Enterprise LTSC Linux LTS Yocto
Operating Temperature	Commercial range: 0 °C ÷ +50 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W) Industrial range: -40 °C ÷ +60 °C* / CPU: 35 W (PL1: 28 W, PL2: 35 W) *The values indicated refer to the maximum temperature of the environment of use of the device. It is the customer’s responsibility to verify that the temperature remains within the admissible range indicated in this manual and, if necessary, adopt any passive cooling solution together with an application-dependent cooling system that can ensure that the heat sink temperature will not damage the device itself and/or the connected mechanical parts.
Dimensions	199 x 174 x 73 mm (7.83’’ x 6.85 “ x 2.87’’) DIN-rail or Wall Mount brackets (Factory Alternatives)