Titan 220 RK3399

IP20 Fanless embedded PC based on Rockchip RK3399 Applications Processor. (DORADO - SYS-C31-IGW)

Data sheet

Wiki

Cpu

Rockchip RK3399

Graphics

4-Core Mali-T860MP4 GPU

Connectivity

1x GbE; 2x USB3.0; 3x USB2.0; 2x RS-232; on-board Wi-Fi+BT5.0; on-board LTE Cat4 modem

Memory

2GB LPDDR4 on-board memory

Product details

Technical Info

Description	IP20 Fanless embedded PC based on Rockchip RK3399 Applications Processor
Cpu	Rockchip RK3399 processor, 2x Cortex®-A72 MP cores + 4xCortex®-A53 MP cores, up to 1.8GHz, 64-bit architecture
Max Cores	4
Memory	64-bit soldered down LPDDR4 memory, 2GB
Graphics	4-Core Mali-T860MP4 GPU OpenGL ES 1.1/2.0/3.0/3.1, OpenVG 1.1, OpenCL, DX11 support Embedded VPU: H.265 10-bit, H.264 10-bit, VP9 8-bit 4Kx2K@60fps hardware decoding MPEG-4/MPEG-2/VP8 1080p@60fps hardware decoding H.264, VP8 1080p@30fps hardware encoding Supports 2 independent video outputs
Video Interfaces	HDMI™ connector DP interface on USB Type-C connector (Alternate mode)
Video Resolution	Up to 4K
Mass Storage	eMMC 5.1 drive on-board, 16GB
Networking	1x Gigabit Ethernet RJ45 connector on-board WiFi (802.11 ac / a / b / g / n) + BT 5.0 module, external antennas on-board LTE Cat4 modem with microSIM slot, external antennas
Usb	3x USB 2.0 Type-A connectors 1x USB 3.0 Type-A connector 1x USB 3.0 Type-C connector (alternate mode with DP)
Serial Ports	2x RS-232 on DB9-M connectors
Other Interfaces	Secure Element microSIM slot soldered on-board for the cellular modem
Power Supply	12 VDC to 24 VDC, DC Power Jack
Operating System	Linux Android
Operating Temperature	-20°C to +50°C * Measured at any point on the heatspreader/heatsink during any and all times (including start-up). Actual temperature will depend on the application, enclosure and/or environment. The customer must consider specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions	177 x 150 x 27 mm