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ZH Dev Kits, Carrier Boards and Accessories
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ME03-DISS-1-PKCom-Exp - Raptor Lake Heat spreader (PASSIVE) - Packaged -
ME03-DISS-3-PKCom-Exp - Raptor Lake Heat sink (ACTIVE) - Packaged -
Carrier-Trizeps-iP5-BaseCarrier Board for Trizeps SODIMM SOMs -
DEV-KIT-Myon-i-PAN-M7HMI for Myon MicroModule SOMs -
DEV-KIT-Trizeps-i-PAN-T7-IIHMI for Trizeps SODIMM SOMs -
DEV-KIT-Trizeps-i-PAN-7HMI for Trizeps SODIMM SOMs -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules -
Carrier-COMe-T6-E10Carrier Board for COM-Express® Rel. 3.1 Type 6 Modules for Development -
DEV-KIT-COMe-T7Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 7 modules. -
DEV-KIT-COMe-T6Cross Platform Development Kit compatible with both x86 and Arm COM Express® Type 6 modules
