Dev Kits, Carrier Boards and Accessories

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  1. HD57-DISS-3-PK
    HD57-DISS-3-PK
    COM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged
  2.  DEV-KIT-COM-HPC-A
    DEV-KIT-COM-HPC-A
    Cross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules

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