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ZH Dev Kits, Carrier Boards and Accessories
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Carrier-SMARC-E71Carrier board for SMARC 2.1.1 modules in a 3.5” form factor -
Carrier-COMe-Type6-C96CCOMe-C96 Carrier Board -
Carrier-COMe-T7-C79CCOMe-C79 Carrier Board -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged -
ME03-DISS-1-PKCom-Exp - Raptor Lake Heat spreader (PASSIVE) - Packaged -
ME03-DISS-3-PKCom-Exp - Raptor Lake Heat sink (ACTIVE) - Packaged -
Carrier-Q7-D03Carrier Board for Qseven® and μQseven® Rev 2.1 Modules in embedded NUC™ Form factor . (Formerly CQ7-D03 ) -
EVAL-KIT-SOM-SMARC-QCS6490Evaluation Kit in 3.5" based on Qualcomm QCS6490 SoC
