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  1. Carrier-SMARC-E71
    Carrier-SMARC-E71
    Carrier board for SMARC 2.1.1 modules in a 3.5” form factor
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  2. Carrier-SMARC-2.0-B79
    Carrier-SMARC-2.0-B79
    Carrier board for SMARC rel. 2.0 / 2.1.1 compliant modules RB79
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  3. HD57-DISS-3-PK
    HD57-DISS-3-PK
    COM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged
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  4. DEV-KIT-COM-HPC-A
    DEV-KIT-COM-HPC-A
    Cross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules
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  5. Carrier-Trizeps-ConXT
    Carrier-Trizeps-ConXT
    Carrier Board for SOM-Trizeps-VII-MX6
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  6. EVAL-KIT-SOM-SMARC-QCS6490
    EVAL-KIT-SOM-SMARC-QCS6490
    Evaluation Kit in 3.5" based on Qualcomm QCS6490 SoC
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