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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.

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  1. SOM-COM-HPC-A-TGL-UP3
    SOM-COM-HPC-A-TGL-UP3
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)
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  2. ME03-DISS-1-PK
    ME03-DISS-1-PK
    Com-Exp - Raptor Lake Heat spreader (PASSIVE) - Packaged
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  3. ME03-DISS-3-PK
    ME03-DISS-3-PK
    Com-Exp - Raptor Lake Heat sink (ACTIVE) - Packaged
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  4. SOM-COM-HPC-A-RPL
    SOM-COM-HPC-A-RPL
    COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
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  5. Titan 290 EHL
    Titan 290 EHL
    Fanless embedded computer with the Intel® Atom® X6000E Series, Intel® Pentium® and Celeron® N and J Series (codename: Elkhart Lake) SoCs. (PYXIS - SYS-D63-IPC)
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  6. Titan 300 TGL-UP3
    Titan 300 TGL-UP3
    Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (codename: Tiger Lake UP3). (PHOENIX - SYS-D64-IPC)
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  7. SBC-3.5-MX8
    SBC-3.5-MX8
    3.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43)
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  8. SBC-3.5-MX8X
    SBC-3.5-MX8X
    3.5” SBC with NXP i.MX 8X Applications Processors. (VESTA - C57)
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  9. SBC-3.5-MX8M-Mini
    SBC-3.5-MX8M-Mini
    3.5” SBC with the NXP i.MX 8M Mini Processors. (ASTRID - C61)
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  10. SBC-3.5-TGL-UP3
    SBC-3.5-TGL-UP3
    SBC 3.5” with the 11th Gen Intel® Core™ and Intel® Celeron® (codename: Tiger Lake-UP3). (PRISMA - D64)
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Cpu Power Consumption
  1. range 10-25 W 11 item
  2. range < 10 W 16 item
  3. range < 5 W 5 item
  4. range > 25 W 9 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 1 item
  3. AMD® Ryzen™ embedded V-Series™ 2 item
  4. Intel® Atom™ 11 item
  5. Intel® Celeron® 13 item
  6. Intel® Core™  13 item
  7. Intel® Pentium®  8 item
  8. Intel® Xeon® 1 item
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NXP i.MX 8M 3 item
  12. NXP i.MX 8M Mini 4 item
  13. NXP i.MX 8M Nano 2 item
  14. NXP i.MX 8M Plus 1 item
  15. NXP i.MX 8X 2 item
  16. NXP i.MX 95 1 item
  17. NXP i.MX6  4 item
  18. NXP i.MX8  1 item
  19. Qualcomm® QCS5430 1 item
  20. Qualcomm® QCS6490 1 item
  21. Rockchip RK3568 1 item
  22. Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 44 item
  2. ETHERNET≥2 22 item
Form Factor
  1. Boxed Solutions 2 item
  2. COM Express® 15 item
  3. COM-HPC® 3 item
  4. Qseven 6 item
  5. Single Board Computer  8 item
  6. SMARC 12 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 3 item
  3. 48,5 x 32,5 mm 1 item
  4. 67,6 x 36,7 mm 4 item
  5. ≤ 100 x 100mm 25 item
  6. ≤ 80 x 80mm 11 item
  7. ≥ 100 x 100mm 8 item
Form Factor Specification
  1. 3,5" 5 item
  2. COM Express Basic 7 item
  3. COM Express Compact 8 item
  4. COM-HPC Client 2 item
  5. Other Single Board Computers 2 item
  6. Pico-ITX 1 item
  7. Qseven 70x70 mm 3 item
  8. µQseven 70x40 3 item
Mass Storage
  1. M.2 NVMe SSD slot 10 item
  2. M.2 SATA SSD slot 5 item
  3. microSD card slot  8 item
  4. onboard eMMC 35 item
  5. onboard SSD 1 item
  6. SATA channels ≥ 1 19 item
  7. SATA channels ≥ 2  18 item
  8. SATA channels ≥ 3 1 item
  9. SATA channels ≥ 4 1 item
  10. SD interface  15 item
  11. standard SATA connector 2 item
Memory
  1. soldered down 24 item
  2. SO_DIMM 17 item
  3. ≤1 38 item
  4. ≤16 16 item
  5. ≤2 36 item
  6. ≤4 35 item
  7. ≤8 28 item
  8. ≥32 16 item
Operating Temperature
  1. -20°C ÷ +60°C 26 item
  2. -20°C ÷ +70°C 9 item
  3. -40°C ÷ +85°C 35 item
  4. 0°C ÷ +50°C 30 item
  5. 0°C ÷ +60°C 41 item
  6. 20°C ÷ +70°C 23 item
Pci Express
  1. PCI-e lanes ≥ 1 29 item
  2. PCI-e lanes ≥ 2 21 item
  3. PCI-e lanes ≥ 3 15 item
  4. PCI-e lanes ≥ 4 19 item
  5. PCI-e lanes ≥ 5 14 item
USB
  1. USB 2.0 ≥ 1  34 item
  2. USB 2.0 ≥ 2  33 item
  3. USB 2.0 ≥ 3 28 item
  4. USB 2.0 ≥ 4 27 item
  5. USB 2.0 ≥ 5 19 item
  6. USB 2.0 ≥ 6 20 item
  7. USB 3.0 ≥ 1 16 item
  8. USB 3.0 ≥ 2 14 item
  9. USB 3.0 ≥ 3 8 item
  10. USB 3.0 ≥ 4 7 item
  11. USB 3.1 ≥ 1 8 item
  12. USB 3.1 ≥ 2 5 item
  13. USB 3.2 ≥ 1 4 item
  14. USB 3.2 ≥ 2 9 item
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 2 item
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 item
  19. USB CLIENT 1 item
  20. USB OTG 13 item
Video Interfaces
  1. DDI 12 item
  2. DP 18 item
  3. DP++ 13 item
  4. DUAL CHANNEL LVDS 32 item
  5. eDP 30 item
  6. HDMI 29 item
  7. MIPI-CSI camera connector 8 item
  8. MIPI-DSI 10 item
  9. PARALLEL RGB 4 item
  10. SINGLE CHANNEL LVDS 30 item
  11. VGA 3 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 9 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 5 item
  3. M.2 Socket 2 key B (SSD) 1 item
  4. ONBOARD WI-FI/BLE 11 item